UCN1V561MCL1GS

The UCN1V561MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon, designed for surface-mount board-level use. It pairs a 560 µF capacitance with a 35 V rated voltage in a compact SMD can package, delivering low ESR and long-life performance for demanding electronic assemblies.

Targeted at reliability-critical designs, the part is AEC-Q200 qualified, RoHS compliant, and rated for operation from -40°C to 125°C with a guaranteed 3,000 hours endurance at 125°C. Typical use cases include automotive electronics and high-temperature or high-reliability power applications where compact, low-ESR bulk capacitance is required.

Key Features

• Electrical specifications — 560 µF nominal capacitance at 35 V rated voltage; capacitance tolerance ±20%.
• Low ESR and ripple handling — ESR specified at 200 mΩ (measured at 100 kHz); rated ripple currents of 250 mA at 120 Hz and 500 mA at 10 kHz.
• High-temperature endurance — Rated for continuous operation from -40°C to 125°C with a 3,000 hour lifetime at 125°C per the endurance specification.
• Reliability and qualification — AEC-Q200 qualified and compliant to the RoHS directive (2011/65/EU,(EU)2015/863), supporting use in environments requiring recognized reliability standards.
• Chip SMD package — Surface-mount radial can (chip type) with physical dimensions L: 1 × D: 1 cm and a recommended land size of 1.03 × 1.03 cm; suitable for automated placement from carrier tape.
• Soldering robustness — Meets resistance to soldering heat requirements described in the product specification (hot plate test, 30 s at 250°C) with minimal characteristic change.
• Polarized component — Designed as a polarized electrolytic capacitor; follow polarity requirements in circuit layout.

Typical Applications

• Automotive electronics — AEC-Q200 qualification and extended temperature range make this capacitor suitable for automotive power and control modules requiring reliable bulk capacitance.
• Automated surface-mount assembly — Chip-type package and carrier-tape compatibility support high-volume automated placement and reflow processes.
• High-temperature power circuits — Specified endurance at 125°C and soldering-heat resistance suit designs exposed to elevated operating or assembly temperatures.

Unique Advantages

• AEC-Q200 qualified — Provides an explicit reliability credential for applications that require industry-recognized qualification.
• Low ESR for improved ripple performance — 200 mΩ ESR at 100 kHz plus rated ripple currents enables effective smoothing and decoupling in power stages.
• Long high-temperature life — 3,000 hours at 125°C endurance specification supports extended service in hot environments.
• Compact chip SMD form factor — 1 × 1 cm case size and surface-mount compatibility reduce board space while enabling automated assembly.
• Wide operating temperature range — Specified for -40°C to 125°C operation, offering stable performance across typical harsh-environment conditions.
• RoHS compliance — Meets current RoHS requirements for restricted substances.

Why Choose UCN1V561MCL1GS?

The UCN1V561MCL1GS balances compact, automated-assembly-friendly packaging with verified high-temperature endurance and low ESR electrical performance. Its AEC-Q200 qualification and RoHS compliance make it a suitable choice for designers who need dependable bulk capacitance in space-constrained surface-mount designs subject to elevated temperatures.

This part is well suited to engineering teams and procurement sourcing components for reliability-focused power electronics, automotive subsystems, and other applications where long life, predictable ripple handling, and compact SMD form factor are required.

If you would like pricing, lead-time, or a formal quote for UCN1V561MCL1GS, please request a quote or submit an inquiry to receive sales and availability information.