UCW0J221MCL1GS

The UCW0J221MCL1GS is a chip-type aluminum electrolytic capacitor in a compact surface-mount can designed for automated assembly. It delivers 220 µF at 6.3 V with low impedance performance specified up to +105°C and a rated load life of 7000 hours at +105°C.

Targeted at demanding electronic assemblies, this AEC-Q200 qualified, RoHS-compliant capacitor supports automotive and other high-reliability applications that require sustained performance at elevated temperatures and compatibility with carrier-tape placement.

Key Features

• Electrical Characteristics — 220 µF nominal capacitance at 6.3 V with tolerance ±20%. Rated impedance indicated as 1 Ω for this part.
• Temperature & Reliability — Operates from −25°C to +105°C with a guaranteed load life of 7000 hours at +105°C; endurance after life test: capacitance change within ±30% and leakage current not greater than the initial specified value.
• Low‑Loss and Low‑Temperature Stability — Maximum tan δ for 6.3 V is 0.32 (measured at 120 Hz, 20°C). Low-temperature impedance ratio Z(−25°C)/Z(+20°C) is 4 for the 6.3 V rating.
• Ripple Current — 115 mA at 120 Hz (low frequency) and 230 mA at 10 kHz (high frequency), supporting smoothing and decoupling duties in compact designs.
• Packaging & Assembly — Chip (can) SMD package suitable for automatic mounting machines fed with carrier tape; package dimensions L: 8.7 × D: 6.3 mm with surface-mount land size L: 6.6 × W: 6.6 mm and seated height max 8.7 mm.
• Soldering and Shelf Durability — Meets resistance-to-soldering-heat criteria (250°C for 30 s) with capacitance change within ±10% and leakage and tan δ within initial specified values; shelf life treatment specified for stability after storage at 105°C for 1000 hours.
• Industry Qualification & Environmental — AEC-Q200 qualified and compliant to RoHS directives (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — For electronic control modules and assemblies where AEC‑Q200 qualification and sustained performance at +105°C are required.
• Surface‑Mount Power Modules — Compact SMD can for automated assembly where space-constrained smoothing and decoupling are needed.
• High‑Temperature Electronics — Use in systems that operate up to +105°C and require long-term capacitance retention and controlled leakage.

Unique Advantages

• Long Elevated‑Temperature Life — 7000 hours at +105°C provides predictable ageing behavior for high-temperature applications.
• Automated Assembly Ready — Chip‑type can packaged for carrier‑tape feeding reduces handling and speeds PCB assembly.
• AEC‑Q200 Qualified — Qualification supports integration into automotive and other high-reliability systems where that rating is required.
• Low‑Impedance Performance to +105°C — Maintains low impedance across the rated temperature range for stable decoupling and smoothing performance.
• Soldering Robustness — Meets specified soldering‑heat resistance (250°C for 30 s) with limited electrical characteristic change, simplifying reflow considerations.
• RoHS Compliant — Meets current RoHS directive requirements for environmentally regulated assemblies.

Why Choose UCW0J221MCL1GS?

UCW0J221MCL1GS combines a compact SMD can package with proven high-temperature endurance and AEC‑Q200 qualification, making it suitable for assemblies that demand reliability, automated placement, and stable performance up to +105°C. Its rated 220 µF capacitance, defined ripple current ratings, and controlled loss tangent offer predictable behavior for designers managing power smoothing and decoupling in constrained layouts.

This part is well suited to engineers and procurement teams designing high-reliability, temperature-challenged electronics—particularly in automotive systems—where long life, assembly efficiency, and regulatory compliance are required.

Request a quote or submit an RFQ to receive pricing and availability information for UCW0J221MCL1GS. Our team will assist with technical details and order support.