UCW0J331MCL1GS

The UCW0J331MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount assemblies. It delivers 330 µF capacitance at a 6.3 V rating in a compact radial can SMD package optimized for automated tape-fed placement.

Engineered for demanding thermal and reliability requirements, this part offers low impedance up to +105°C, a rated operating range of −25°C to +105°C, and long life assurance suitable for automotive and other high-temperature applications.

Key Features

• Electrical Performance — 330 µF capacitance with ±20% tolerance and polarization for DC applications; impedance specified as 1 Ω.
• Voltage Rating — Rated at 6.3 V for low-voltage power rails and local energy storage.
• Ripple Handling — Specified ripple current of 115 mA at 120 Hz and 230 mA at 10 kHz to support ripple filtering and decoupling tasks.
• High-Temperature Performance — Operates from −25°C to +105°C with low-impedance behavior maintained up to +105°C.
• Long Life Endurance — Load life of 7000 hours at +105°C, with specified limits for capacitance change, tan δ, and leakage current after endurance testing.
• Assembly & Package — Chip-type radial, can-style SMD designed for automatic mounting from carrier tape; recommended land pattern L: 6.6 × W: 6.6 mm.
• Compliance & Qualification — AEC-Q200 qualified and RoHS compliant.
• Compact Dimensions — Case size L: 8.7 × D: 6.3 mm for space-constrained board layouts.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and 7000-hour life at 105°C support use in vehicle electronics exposed to elevated temperatures.
• Power Supply Decoupling — High capacitance with low impedance and defined ripple current ratings provides local energy buffering and noise suppression on power rails.
• High-Temperature Embedded Systems — Suitable for compact systems that require reliable capacitance performance across −25°C to +105°C.
• Automated Surface-Mount Production — Tape-fed, chip-type SMD package designed for high-throughput pick-and-place assembly in compact layouts.

Unique Advantages

• Extended High-Temperature Endurance: 7000 hours at +105°C offers predictable long-term performance in thermally demanding environments.
• Low-Impedance Operation at Elevated Temperatures: Low impedance behavior up to +105°C supports stable decoupling and filtering where temperature varies.
• Defined Ripple Current Capability: Published ripple current values at 120 Hz and 10 kHz enable reliable sizing for AC stress and power conditioning.
• Automotive-Grade Qualification: AEC-Q200 qualification aligns the component with automotive reliability requirements for qualified designs.
• Surface-Mount, Tape-Feed Ready: Chip-type radial can SMD format and specified land pattern simplify integration into automated assembly flows.
• Compact Footprint: 8.7 × 6.3 mm case size supports high-density board designs without sacrificing capacitance.

Why Choose UCW0J331MCL1GS?

The UCW0J331MCL1GS balances high capacitance and compact packaging with proven high-temperature endurance and AEC-Q200 qualification. It is suited to engineers designing reliable, space-efficient power systems that must tolerate elevated temperatures and continuous operation.

This part is a practical choice for designs that require a tape-fed surface-mount electrolytic capacitor with specified ripple handling, long life at +105°C, and compliance with RoHS and automotive qualification standards.

If you would like pricing, availability, or a quote for UCW0J331MCL1GS, please submit a request or contact our sales team to discuss your project requirements and volume needs.