UCZ1E222MNS1MS

CAP ALUM 2200UF ±20% 25V SMD
Part Description

2200 µF 25 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 928 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUCZ
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotive, High Temperature ReflowCapacitance2.2 mFECCNEAR99
ESR45 mOhm @ 100 kHzHeight Seated (Max)1.75 cmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp3500 h @ 125°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 125°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency2.6 A @ 10 kHzRipple Current Low Frequency1.3 A @ 120 Hz
RoHS ComplianceCompliantSize / Dimension16.5 x 18 mmSurface Mount Land Size18.3 x 18.3 mm
Tolerance-20%~20%Voltage25 V

Overview of UCZ1E222MNS1MS – Surface-Mount Aluminum Electrolytic Capacitor, 25 V, 2200 µF

The UCZ1E222MNS1MS is a surface-mount aluminum electrolytic, chip-type capacitor from Nichicon's UCZ series. It provides 2.2 mF (2200 µF) capacitance at a rated voltage of 25 V with a capacitance tolerance of ±20%.

Designed for high-temperature operation and automated assembly, this part targets demanding applications that require bulk energy storage and stable performance across -40°C to 125°C. Key attributes include low ESR, high ripple-current capability, long endurance at elevated temperature, and AEC-Q200 qualification for automotive applications.

Key Features

  • Capacitance & Voltage — 2200 µF (2.2 mF) nominal capacitance, rated for 25 V with ±20% tolerance at 120 Hz, 20°C.
  • Low Loss / Dissipation — tanδ (DF) of 0.2 measured at 20°C, 120 Hz, supporting predictable AC performance.
  • Low ESR — ESR of 45 mΩ measured at 20°C and 100 kHz, helping reduce voltage drop and heat generation in high-frequency circuits.
  • High Ripple Current Capability — 1.3 A at 120 Hz (low frequency) and 2.6 A at high frequency, enabling robust smoothing and decoupling under dynamic load conditions.
  • Leakage Current — Specified leakage current of 550 µA, suitable for power-holding applications where controlled leakage is required.
  • High-Temperature Endurance — Rated life of 3500 hours at 125°C, with endurance characteristics defined after continuous application of rated voltage at 125°C.
  • Wide Operating Temperature — −40°C to +125°C operating range for use in harsh thermal environments.
  • Package & Mounting — Chip-type can-style SMD package (φ18 × 16.5L) designed for surface-mount assembly and supplied in embossed carrier taping for automated placement.
  • Reliability & Qualification — AEC-Q200 rated and RoHS compliant, targeting high-reliability system designs.
  • Vibration Resistance — Constructed to resist vibration, improving robustness in mechanically demanding installations.

Typical Applications

  • Automotive Electronics — Engine control units, power modules, and other in-vehicle systems that require AEC-Q200-qualified bulk capacitance and operation across −40°C to +125°C.
  • High-Temperature Power Electronics — Power supplies and converters operating at elevated ambient temperatures where endurance at 125°C and long life are required.
  • Surface-Mount Power Modules — Board-level bulk storage and smoothing in compact SMD assemblies, enabled by the chip-style can package and embossed carrier taping.

Unique Advantages

  • AEC-Q200 Qualification: Explicit AEC-Q200 rating supports use in automotive and other high-reliability systems.
  • High-Temperature Endurance: 3500-hour rating at 125°C delivers predictable aging and life-cycle characteristics in hot environments.
  • Low ESR at High Frequency: 45 mΩ (100 kHz) minimizes losses and improves ripple performance in switching and high-frequency applications.
  • Strong Ripple Handling: 2.6 A high-frequency ripple current capability and 1.3 A at 120 Hz allow effective decoupling under dynamic loads.
  • Assembly-Ready Packaging: Embossed carrier taping supports automated pick-and-place for high-volume manufacturing.
  • Compact Chip Can Form Factor: φ18 × 16.5L package provides substantial bulk capacitance in a board-friendly SMD footprint.

Why Choose UCZ1E222MNS1MS?

UCZ1E222MNS1MS delivers a combination of high capacitance, low ESR, and validated high-temperature endurance tailored for demanding designs. Its AEC-Q200 rating and −40°C to +125°C operating range make it suitable for automotive and other high-reliability applications that require sustained performance under thermal and mechanical stress.

Choose this part when your design needs compact, surface-mount bulk energy storage with strong ripple handling, controlled leakage characteristics, and supply-chain-ready packaging for automated assembly.

Request a quote or contact sales to discuss availability, lead times, and pricing for UCZ1E222MNS1MS.

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