UCZ1E330MCL1GS

The UCZ1E330MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon's UCZ series, rated 33 µF at 25 V. It is a surface-mount, polar capacitor designed for high-reliability applications requiring operation across a wide temperature range.

This part targets assemblies and systems that need compact SMD power storage with defined low-temperature ESR behavior, high-temperature endurance, and compatibility with automated board assembly processes.

Key Features

• Electrical Performance — 33 µF nominal capacitance with ±20% tolerance and rated voltage of 25 V; leakage current specified at 8.25 µA.
• Low‑Temperature ESR Specification — ESR specified at 1.6 Ω (1600 mΩ) measured at 20 °C / 100 kHz, with added ESR characterization after -40 °C testing.
• Ripple Current Ratings — Low-frequency ripple current 34.5 mA (120 Hz) and high-frequency ripple current 69 mA (10 kHz), suitable for mixed-frequency power environments.
• High Temperature Endurance — Rated for continuous operation up to +125 °C with a life/endurance specification of 1000 hours at 125 °C.
• Reliability and Qualification — AEC‑Q200 rating is provided for high-reliability applications; RoHS‑compliant construction.
• Compact SMD Package — Radial can SMD chip (φ6.3 × 5.8 L) optimized for surface-mount placement; recommended PCB land size 6.6 × 6.6 mm.
• Assembly Compatibility — Supplied in embossed carrier tape for automatic mounting machines and tested for resistance to soldering heat (250 °C for 30 s per datasheet conditions).

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and -40 °C to +125 °C temperature range make this capacitor suitable for automotive control modules and electronic assemblies.
• High‑Temperature Electronics — Designed for systems that require reliable capacitance and specified endurance at elevated ambient temperatures up to +125 °C.
• Automated Surface‑Mount Production — Embossed carrier taping and chip‑type SMD packaging simplify integration with pick‑and‑place and reflow assembly lines.

Unique Advantages

• Defined low‑temperature ESR behavior: ESR specified after -40 °C testing provides predictable performance in cold-start or low‑temperature conditions.
• High‑temperature endurance: 1000‑hour rating at 125 °C supports long-term stability in hot operating environments.
• Compact footprint: φ6.3 × 5.8 mm can size reduces PCB area while delivering 33 µF capacitance in an SMD form factor.
• Manufacturing‑friendly packaging: Embossed carrier taping and SMD can construction facilitate high‑volume automated assembly.
• Verified qualification and compliance: AEC‑Q200 rating and RoHS compliance support deployment in regulated, high-reliability designs.
• Measured ripple handling: Specified low‑ and high‑frequency ripple currents (34.5 mA @120 Hz, 69 mA @10 kHz) provide clear limits for thermal and lifetime assessments.

Why Choose UCZ1E330MCL1GS?

UCZ1E330MCL1GS combines compact SMD packaging with explicitly characterized electrical and thermal performance, including low‑temperature ESR data and a 1000‑hour endurance at 125 °C. Its AEC‑Q200 qualification and RoHS compliance make it a suitable option for designers specifying components for demanding environments where predictable behavior across temperature and automated assembly compatibility are required.

This part is well suited to engineers and procurement teams developing high‑reliability electronic assemblies that need clear, verifiable specifications for capacitance, ESR, ripple handling, leakage, and thermal endurance.

If you would like pricing, availability, or to request a formal quote for UCZ1E330MCL1GS, please submit an inquiry to our sales team specifying required quantities and lead‑time expectations.