UCZ1H821MNJ1MS
| Part Description |
820 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,945 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCZ |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 820 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | 78 mOhm @ 100 kHz | Height Seated (Max) | 1.75 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 3500 h @ 125°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 125°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 2.1 A @ 10 kHz | Ripple Current Low Frequency | 1.05 A @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 16.5 x 18 mm | Surface Mount Land Size | 18.3 x 18.3 mm | ||
| Tolerance | -20%~20% | Voltage | 50 V |
Overview of UCZ1H821MNJ1MS – Aluminum Electrolytic Chip Capacitor, 820 µF, 50 V
The UCZ1H821MNJ1MS is a high-reliability, chip-type aluminum electrolytic capacitor designed for surface-mount assembly and operation in elevated-temperature environments. It delivers 820 µF at 50 V in a compact SMD can package and is engineered for applications requiring robust filtering and bulk energy storage at temperatures up to +125 °C.
This part is AEC-Q200 qualified and RoHS compliant, offers a low-temperature ESR specification (with ESR measured at 78 mΩ at 100 kHz), and is compatible with automated tape-fed pick-and-place assembly for production-scale manufacturing.
Key Features
- Capacitance & Voltage — 820 µF rated capacitance with a 50 V rated voltage and ±20% tolerance for bulk decoupling and energy storage.
- High Temperature Operation — Rated for continuous use from −40 °C to +125 °C with endurance specified (3500 hours at 125 °C for the given case size).
- Low-Temperature ESR — Includes a low-temperature ESR specification; equivalent series resistance is specified as 78 mΩ at 100 kHz.
- Ripple Current Capability — Supports 1.05 A ripple at 120 Hz and 2.1 A at 10 kHz, enabling reliable filtering in high-dynamic power circuits.
- Automotive-Grade Reliability — AEC-Q200 qualified to support designs that require automotive-level qualification.
- Surface-Mount, Tape-Feed Compatible — Chip-type SMD can package designed for automatic mounting machines; recommended PCB land size L: 1.83 × W: 1.83 cm.
- Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).
Typical Applications
- Automotive power rails — Bulk decoupling and smoothing for ECUs and control modules where AEC-Q200 qualification and +125 °C capability are required.
- DC–DC converters — Input/output filtering and energy storage in converters that demand high ripple handling and stability across temperature.
- Industrial power electronics — Bulk capacitance for embedded controllers and power modules operating in harsh or high-temperature environments.
- Motor drive and inverter systems — Energy buffering and ripple suppression in systems with elevated thermal stress and dynamic current demands.
Unique Advantages
- Designed for high ambient temperatures — Rated to +125 °C with long-term endurance (3500 hours at 125 °C), supporting durability in thermally demanding designs.
- Low-temperature performance guaranteed — ESR behavior is specified after −40 °C testing, improving predictability in cold-start and wide-temperature-range applications.
- Measurable ripple capability — Specified ripple currents at both low and high frequencies (1.05 A @120 Hz, 2.1 A @10 kHz) help ensure reliable filtering in switching power circuits.
- Automotive-grade qualification — AEC-Q200 qualification provides traceable automotive-level reliability for safety- and reliability-focused projects.
- Assembly-ready SMD form factor — Chip-type can packaging and tape-feed compatibility reduce PCB complexity and support automated assembly workflows.
- Compact footprint with clear land sizing — Physical dimensions and recommended land pattern (L: 1.83 × W: 1.83 cm) enable predictable layout and mechanical integration.
Why Choose UCZ1H821MNJ1MS?
The UCZ1H821MNJ1MS positions itself as a dependable solution for designers who need bulk capacitance and stable ESR across a wide temperature range. With 820 µF at 50 V, specified ripple ratings, and AEC-Q200 qualification, it is suited to demanding power-supply and control applications in automotive and industrial environments.
Engineers designing for high ambient temperature, long-life operation, and automated assembly will find this part helps reduce design risk: its endurance specification, low-temperature ESR requirements, and tape-feed SMD packaging offer a practical balance of performance, durability, and manufacturability.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for UCZ1H821MNJ1MS. Please include your required quantity and delivery timeline to help expedite the response.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016