UCZ1V330MCS1GS
| Part Description |
33 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,506 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCZ |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 33 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | 450 mOhm @ 100 kHz | Height Seated (Max) | 8 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 125°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 125°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 197 mA @ 10 kHz | Ripple Current Low Frequency | 98.5 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 7.7 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 35 V |
Overview of UCZ1V330MCS1GS – 33 µF, 35 V Chip Aluminum Electrolytic Capacitor
The UCZ1V330MCS1GS is a Nichicon UCZ series chip-type aluminum electrolytic capacitor designed for surface-mount assembly. It delivers 33 µF at 35 V in a compact φ6.3 × 7.7 mm SMD can and is offered in embossed carrier taping for automated placement.
Engineered for demanding thermal environments, this part supports an operating range of −40 °C to 125 °C, carries AEC-Q200 qualification, and is supplied in mass-production volumes—suited for reliability-focused electronics where compact, high-temperature-capable bulk capacitance is required.
Key Features
- Capacitance & Voltage — 33 µF nominal capacitance with a 35 V rated voltage and tolerance of −20% to +20%, providing predictable energy storage for power rails.
- High-temperature Endurance — Rated for operation from −40 °C to 125 °C with an endurance specification of 2000 hours at 125 °C for the φ6.3 × 7.7L case size.
- Low-temperature ESR Specified — ESR of 450 mΩ measured at 20 °C/100 kHz with added low-temperature ESR characterization in the UCZ series datasheet.
- Ripple Current Performance — Low-frequency ripple current of 98.5 mA (120 Hz) and high-frequency ripple current of 197 mA (10 kHz) to support smoothing and decoupling in switching power applications.
- Leakage & Loss — Leakage current specified at 11.55 µA and tanδ (DF) of 0.16 measured at 20 °C/120 Hz for stable loss characteristics under nominal conditions.
- Surface-mount, Automated Assembly Ready — Chip-type SMD can packaged in embossed carrier tape for compatibility with automated pick-and-place processes.
- AEC-Q200 Qualified — Built to meet AEC-Q200 requirements, supporting use where automotive-grade qualification is required.
Typical Applications
- Automotive Electronics — Bulk decoupling and smoothing on 35 V rails in automotive ECUs and modules that require components qualified to AEC-Q200 and capable of operation up to 125 °C.
- Power Supply Filtering — AC ripple suppression and energy storage for DC-DC converters and switching supplies where compact board space and thermal endurance are important.
- Industrial Controls — Stabilization and transient buffering in control electronics that operate across wide temperature ranges and demand reliable, long-life capacitors.
Unique Advantages
- Compact high-voltage SMD — 33 µF at 35 V in a φ6.3 × 7.7 mm package reduces board area while delivering significant bulk capacitance.
- High-temperature rated — 2000-hour endurance at 125 °C supports designs exposed to elevated ambient or board-level temperatures.
- Quantified ripple capability — Both low-frequency and high-frequency ripple current specifications (98.5 mA @120 Hz, 197 mA @10 kHz) allow designers to size capacitors confidently for switching and smoothing applications.
- Automotive-grade qualification — AEC-Q200 rating aligns the component with applications that require automotive reliability standards.
- Assembly-ready packaging — Embossed carrier taping facilitates automated surface-mount placement and efficient high-volume assembly.
- Measured loss and leakage — Specified tanδ and leakage current values provide predictable dissipation and standby behavior for thermal and power budgeting.
Why Choose UCZ1V330MCS1GS?
UCZ1V330MCS1GS combines compact SMD packaging with high-temperature endurance and AEC-Q200 qualification to serve applications where reliability, thermal resilience, and space savings matter. Its defined ESR, ripple current, and leakage characteristics make it straightforward to integrate into power-management and filtering designs that run at elevated temperatures.
This part is ideal for engineers designing automotive and industrial electronics who need a proven chip-type aluminum electrolytic capacitor with automated-assembly packaging and mass-production availability. The UCZ series’ documented endurance and low-temperature ESR data help reduce design uncertainty and support long-term product robustness.
For pricing, lead times, or to request a quote for UCZ1V330MCS1GS, please submit a quotation request or contact sales through the manufacturer's commercial channels referencing the part number.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016