UUG2E470MNJ1MS

The UUG2E470MNJ1MS is a surface-mount aluminum electrolytic chip capacitor in Nichicon’s UUG series, designed to deliver high bulk capacitance in a compact SMD can. It combines a 470 µF nominal capacitance and 25 V rated voltage with a chip-style package for board-level bulk storage and filtering where space and reliability matter.

Targeted at applications requiring higher capacitance in a surface-mount format, the part offers defined ripple handling, leakage characteristics, and endurance for demanding operating conditions up to 85°C.

Key Features

• Capacitance and Tolerance — 470 µF nominal capacitance with ±20% tolerance, providing substantial bulk storage for smoothing and decoupling.
• Rated Voltage — 25 V rated voltage suitable for a range of low-voltage power rails and DC–DC converter outputs.
• Loss Characteristics (tan δ) — tanδ specified at 0.12 (measured at 20°C, 120 Hz), enabling predictable ESR-related behavior in filtering applications.
• Ripple Current Performance — Low-frequency ripple current of 740 mA and high-frequency ripple current of 1150 mA (as specified), supporting dynamic load smoothing across frequency ranges.
• Leakage Current — Leakage current specified at 705 µA (measured after 1 minute at 20°C), aiding margin calculations for standby and bias conditions.
• Endurance and Temperature Range — 2000 hours life at 85°C and operating range from −40°C to +85°C, suited to prolonged duty in elevated-temperature environments.
• Package and Mounting — Chip-type radial can for surface-mount placement, case size φ16×21.5 mm, supplied in embossed carrier taping for automated assembly.
• AEC Qualification — Rated to AEC‑Q200, indicating suitability for automotive-grade component requirements where that qualification is specified.

Typical Applications

• Automotive power systems — Bulk energy storage and smoothing on vehicle power rails where surface-mount, high-capacitance components are required.
• DC–DC converter outputs — Provides bulk capacitance and ripple attenuation for converters operating up to the part’s 25 V rating.
• High-capacitance SMD designs — Compact chip can form factor for board layouts that demand larger capacitance without through-hole components.

Unique Advantages

• Substantial bulk capacitance in SMD — 470 µF nominal value delivers large energy storage in a surface-mount can, reducing the need for multiple smaller parts.
• Defined ripple performance — Specified low- and high-frequency ripple currents give designers concrete margins for thermal and ripple budgeting.
• Predictable loss and leakage specifications — tanδ and leakage current values support accurate ESR and standby current calculations.
• Endurance at elevated temperature — 2000 h at 85°C rating enables deployment in sustained high-temperature environments with defined life expectations.
• Automotive-grade qualification — AEC‑Q200 rating supports use in vehicle electronics where that qualification is required.
• Assembly-ready packaging — Embossed carrier taping simplifies pick-and-place integration for automated manufacturing.

Why Choose UUG2E470MNJ1MS?

The UUG2E470MNJ1MS positions itself as a compact, high-capacitance surface-mount solution for engineers who need predictable ripple handling, defined loss/leakage characteristics, and endurance for elevated-temperature applications. Its chip-style radial can and embossed carrier taping make it straightforward to integrate into automated assembly flows where board space and bulk capacitance are priorities.

This part is well suited to designs and customers targeting automotive and other demanding environments where AEC‑Q200 qualification, long-term endurance at 85°C, and clearly specified ripple and leakage data are required for accurate system-level design and qualification.

Request a quote or contact sales to discuss availability, lead times, and application-specific questions for the UUG2E470MNJ1MS.