UUJ0J332MNQ1MS

The UUJ0J332MNQ1MS is a chip-type aluminum electrolytic capacitor from Nichicon’s UUJ series, offering high capacitance in larger chip case sizes and designed for surface-mount assembly on high-density PC boards. It targets applications that require bulk energy storage and filtering in compact, tape-fed SMD formats, with qualification for automotive-grade reliability.

Key value comes from its 3.3 mF capacitance at 6.3 V, robust ripple current handling, long high-temperature endurance and AEC‑Q200 qualification—all in an SMD radial can package suitable for automatic assembly.

Key Features

• High Capacitance (3.3 mF): Large bulk capacitance for energy storage and smoothing where space-efficient SMD mounting is required.
• Rated Voltage 6.3 V: Designed for low-voltage power rails and decoupling tasks at 6.3 V systems.
• Surface-Mount Chip Package: Chip-type, radial can SMD package engineered for high-density PC boards and compatibility with carrier-tape automatic mounting.
• Automotive Qualification (AEC‑Q200): AEC‑Q200 qualification for applications demanding automotive-level reliability.
• Wide Operating Temperature: Specified for −55 °C to +105 °C to cover demanding thermal environments.
• Long High‑Temperature Life: 5,000 hours at 105 °C endurance rating for sustained reliability under elevated temperature stress.
• High Ripple Current Capability: 930 mA at 120 Hz and 1.069 A at 10 kHz to support switching and power-conversion applications.
• Polarized Design with ±20% Tolerance: Standard polarized electrolytic behavior with capacitance tolerance of −20% to +20%.
• RoHS Compliant: Meets RoHS directive requirements for restricted substances.
• Board Land Recommendation: Surface-mount land size specified as 1.83 × 1.83 cm to aid PCB layout and assembly.

Typical Applications

• Automotive Electronic Modules: AEC‑Q200 qualification and wide temperature range suit power filtering, energy buffering and decoupling in automotive control units.
• High-Density PCB Power Filtering: Chip-type SMD package enables bulk capacitance placement on compact, densely populated boards for power-supply smoothing.
• Automatic Assembly Lines: Designed for carrier-tape feed and automatic mounting machines, simplifying high-volume production integration.

Unique Advantages

• Bulk Capacitance in an SMD Form Factor: 3.3 mF capacitance delivers substantial energy storage while maintaining a surface-mount packaging approach for compact designs.
• Automotive-Grade Reliability: AEC‑Q200 qualification provides formalized reliability validation for systems requiring automotive-level performance.
• Thermal Endurance: 5,000 hours at 105 °C supports long-term operation in elevated-temperature environments common to power electronics.
• Robust Ripple Handling: Specified ripple currents at both 120 Hz and 10 kHz accommodate a range of power-conversion and filtering duties.
• Manufacturing-Ready Packaging: Chip design and carrier-tape compatibility facilitate automated pick-and-place assembly and high-volume production.
• Regulatory Compliance: RoHS compliance helps simplify environmental compliance across regions.

Why Choose UUJ0J332MNQ1MS?

The UUJ0J332MNQ1MS combines high bulk capacitance and proven electrolytic performance with a surface-mount chip package engineered for automated assembly and high-density PCBs. Its AEC‑Q200 qualification, wide −55 °C to +105 °C operating range and 5,000‑hour endurance at 105 °C make it well suited for designers seeking a reliable energy-storage capacitor for automotive and other demanding applications.

This part is appropriate for engineers and procurement teams looking to balance high capacitance, ripple capability and long-term thermal stability in a manufacturable SMD form factor backed by Nichicon’s UUJ series specifications.

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