UUJ0J332MNQ6MS

The UUJ0J332MNQ6MS from Nichicon is a surface-mount aluminum electrolytic capacitor in the UUJ series, offering 3.3 mF capacitance at a 6.3 V rating in a φ16 × 21.5 mm can-style SMD package. It targets designs that require high capacitance in a chip-style, surface-mount form factor with AEC-Q200 qualification and RoHS compliance.

Designed for automated assembly, this part delivers long endurance (5,000 hours at 105°C) and elevated ripple handling for applications that must tolerate extended thermal stress and continuous ripple currents.

Key Features

• Electrical Performance — 3.3 mF (3300 µF) nominal capacitance with a tolerance of −20% to +20% and a rated voltage of 6.3 V.
• Loss and Leakage — Specified tanδ (DF) of 0.3 measured at 20°C, 120 Hz, and a measured leakage current of 623.7 µA.
• Ripple Current Capacity — Low-frequency ripple current of 930 mA at 120 Hz and high-frequency ripple current of 1.069 A at 10 kHz, supporting continuous ripple conditions within specified limits.
• Reliability & Endurance — Rated for 5,000 hours at 105°C with defined endurance limits for capacitance, tanδ and leakage after the life test.
• Temperature Range — Operates from −55°C to +105°C, providing a wide operating window for demanding thermal environments.
• Package & Assembly — φ16 × 21.5 mm radial can in an SMD configuration, shipped in embossed carrier taping suitable for automatic placement machines; surface-mount land size 1.63 × 1.63 cm.
• Standards & Compliance — AEC-Q200 qualified and RoHS compliant.

Typical Applications

• Automotive electronics — AEC-Q200 qualification and −55°C to +105°C rating make the capacitor suitable for automotive electronic modules that require high SMD capacitance and long-term endurance.
• High-density PCB assemblies — Chip-type SMD package and embossed carrier taping enable automated placement on space-constrained, high-density printed circuit boards.
• Power subsystem smoothing — Large 3.3 mF capacitance combined with specified ripple current capability supports smoothing and bulk capacitance needs in low-voltage power rails.

Unique Advantages

• High capacitance in an SMD chip form: 3.3 mF in a φ16 × 21.5 mm SMD can provides significant bulk capacitance where board space is limited.
• Designed for automated assembly: Embossed carrier taping and surface-mount compatibility streamline placement for high-volume manufacturing.
• Long-term thermal endurance: Rated 5,000 hours at 105°C, delivering verifiable life performance for thermally demanding applications.
• Robust ripple handling: Defined low- and high-frequency ripple current ratings (930 mA at 120 Hz, 1.069 A at 10 kHz) support continuous ripple stress within specified limits.
• Industry qualifications: AEC-Q200 qualification and RoHS compliance provide traceable conformity to industry requirements.

Why Choose UUJ0J332MNQ6MS?

The UUJ0J332MNQ6MS combines substantial 3.3 mF capacitance with an SMD chip-style can and embossed carrier taping for automated assembly, addressing designs that demand bulk capacitance in a compact footprint. Its defined ripple current capability, wide operating temperature range (−55°C to +105°C) and 5,000-hour endurance at 105°C make it suitable for applications requiring durability under thermal and ripple stress.

This part is positioned for engineers and procurement teams specifying long-life, high-capacitance SMD aluminum electrolytics with AEC-Q200 qualification and RoHS compliance. Use it when you need verifiable endurance, compact form factor, and automated-assembly compatibility.

Request a quote or contact sales to discuss specifications, availability, and procurement details for UUJ0J332MNQ6MS.