UUN1J101MNJ1MS

The UUN1J101MNJ1MS is a chip‑type, bi‑polarized aluminum electrolytic capacitor designed for surface mounting on high‑density PC boards. It delivers 100 µF nominal capacitance at a 63 V rated voltage in a compact SMD can package suitable for automated assembly.

Engineered for general‑purpose applications, this part offers wide operating temperature range and endurance characteristics that support designs requiring reliable bipolar operation and higher capacitance in a surface‑mount form factor.

Key Features

• Bi‑Polarized Construction Allows use in circuits where polarity may invert or where AC‑coupling is required; specified as a bi‑polarized series.
• Capacitance & Voltage 100 µF nominal capacitance with a 63 V rated voltage and ±20% tolerance (measured at 120 Hz, 20°C).
• Wide Temperature Range Specified for operation from −55°C to +105°C to support designs that span broad thermal environments.
• Endurance & Reliability Endurance rating of 2000 hours at 105°C with polarity inversion testing; leakage current specification after 1 minute is ≤ 0.03 C V (µA).
• Ripple Current Performance Rated ripple current of 270 mA at 120 Hz and 405 mA at 10 kHz, with frequency coefficients provided in the series datasheet.
• Chip SMD Package Radial, can‑style SMD package sized L: 1.65 × D: 1.6 cm with recommended land pattern L: 1.63 × W: 1.63 cm, designed for automatic tape‑feed mounting.
• Loss Tangent Specified tan δ max of 0.10 at the 63 V rating (measurement at 120 Hz, 20°C).
• RoHS Compliant Conforms to the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• General‑Purpose Power Filtering Bulk and decoupling applications on high‑density PCBs where 100 µF at 63 V is required to stabilize power rails.
• AC Coupling and Bipolar Signal Circuits Bi‑polarized construction enables use in circuits where polarity can reverse or for AC‑coupling between stages.
• Automated Assembly Environments Chip SMD package and carrier‑tape compatibility make this part suitable for surface‑mount production lines.
• High‑Density PCB Designs Compact can‑style SMD footprint allows higher capacitance to be placed on space‑constrained boards.

Unique Advantages

• Bi‑polarized versatility: Enables deployment in applications with changing polarity or AC signals without requiring polarity-specific handling.
• High capacitance in SMD form: Provides 100 µF in a chip package, simplifying layout on dense PCBs while maintaining needed capacitance.
• Wide operating temperature: −55°C to +105°C rating supports a broad range of environmental conditions and thermal profiles.
• Documented endurance: 2000 hours at 105°C with defined post-test limits for capacitance, tan δ and leakage current supports long‑term reliability planning.
• Measurable ripple capability: Specified ripple current values at 120 Hz and 10 kHz allow predictable thermal and ripple handling in power designs.
• Assembly‑friendly packaging: Designed for tape‑feed automatic mounting, reducing handling complexity in production.

Why Choose UUN1J101MNJ1MS?

UUN1J101MNJ1MS positions itself as a practical solution when designers need higher capacitance in a surface‑mount aluminum electrolytic with bi‑polar capability. Its combination of 100 µF at 63 V, documented ripple current numbers, and −55°C to +105°C operating range make it suitable for general‑purpose power filtering and AC‑coupling applications on compact, automated assembly lines.

For teams balancing PCB density, predictable ripple performance, and long‑term endurance, this Nichicon UUN series part provides verifiable specifications and RoHS compliance to support robust design and procurement decisions.

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