UUN1J331MNJ6MS

The UUN1J331MNJ6MS is a chip‑type, bi‑polar aluminum electrolytic capacitor designed for surface mounting on high‑density PC boards. It delivers 330 µF capacitance at a 63 V rating in a radial can SMD package, targeting general purpose electronic designs that require higher capacitance in larger case sizes.

Key value comes from its bi‑polar construction and extended operating temperature range of −55 °C to +105 °C, combined with RoHS compliance and compatibility with automatic carrier‑tape mounting for streamlined production.

Key Features

• Capacitance & Voltage: 330 µF nominal capacitance with a 63 V rated voltage and ±20% tolerance at 120 Hz, 20 °C.
• Bi‑Polar Construction: Bi‑polarized design suitable for applications that require non‑polar behavior; endurance testing includes polarity inversion during high‑temperature stress.
• Temperature Range & Endurance: Operation from −55 °C to +105 °C with an endurance rating of 2000 hours at 105 °C (tested with polarity inverted every 250 hours).
• Surface‑Mount Package: Chip type radial can SMD package sized L: 2.15 cm × D: 1.8 cm with a recommended land size of 1.83 × 1.83 cm; designed for high‑density PCB mounting and automatic tape feeding.
• Ripple Current Capability: Rated ripple current of 590 mA at 120 Hz and 885 mA at 10 kHz for the 330 µF value, reflecting frequency‑dependent ripple handling.
• Leakage & Loss Characteristics: Leakage current after 1 minute at 20 °C is specified as not more than 0.03CV (µA). Tangent of loss angle (tan δ) at 63 V is specified up to 0.10 (measurement at 120 Hz, 20 °C).
• Low‑Temperature Stability: Impedance ratios for 63 V: Z(−25 °C)/Z(+20 °C) ≤ 2 and Z(−40 °C)/Z(+20 °C) ≤ 3 (measured at 120 Hz).
• Regulatory Compliance: Compliant with the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• General purpose electronic assemblies: Provides bulk capacitance and decoupling on surface‑mount, high‑density PCBs where a bi‑polar capacitor is required.
• Precision equipment and instrumentation: Used where stable capacitance and defined leakage characteristics are important across a wide temperature range.
• Automated manufacturing environments: Designed for carrier‑tape feeding to support high‑volume SMT assembly processes.

Unique Advantages

• Higher capacitance in larger chip sizes: 330 µF in a chip‑type radial can SMD allows designers to pack more capacitance into surface‑mount designs without moving to through‑hole parts.
• Wide operating temperature window: Rated from −55 °C to +105 °C for reliable performance across varied environmental conditions.
• Endurance validated at elevated temperature: 2000 hours at 105 °C with specified post‑test limits ensures predictable long‑term behavior under thermal stress.
• Frequency‑aware ripple handling: Specified ripple currents at 120 Hz and 10 kHz (590 mA and 885 mA respectively) support designs with diverse switching and ripple profiles.
• Surface‑mount and production ready: Land pattern guidance and carrier‑tape compatibility simplify PCB layout and automated assembly integration.
• RoHS compliant: Meets RoHS directives for environmental and regulatory alignment in modern electronics manufacturing.

Why Choose UUN1J331MNJ6MS?

The UUN1J331MNJ6MS positions itself as a practical surface‑mount solution when designers need 330 µF of bi‑polar capacitance at 63 V with proven thermal endurance. Its combination of higher capacitance in a chip‑type radial can, clear ripple current specifications, and wide temperature capability makes it suitable for general purpose electronics and production environments that require reliable, repeatable performance.

This part is appropriate for engineers and procurement teams focused on compact, surface‑mount capacitor solutions that integrate with automated assembly and need verifiable specifications for leakage, loss, impedance stability, and long‑term endurance.

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