UUP0J330MCL1GS

The UUP0J330MCL1GS is a chip-type, bi-polar aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It delivers 33 µF capacitance at a 6.3 V rating and is built to operate across a wide temperature range from −55 °C to +105 °C.

Engineered for automated assembly and elevated-temperature environments, this part is RoHS compliant and AEC-Q200 qualified, making it suited for demanding applications that require compact, reliable SMD capacitors.

Key Features

• Capacitance & Voltage  33 µF capacitance with a rated voltage of 6.3 V and tolerance of −20% to +20%.
• Bi‑Polar Construction  Non‑polar (bi‑polar) design suitable where polarity reversal or AC coupling may occur.
• High Temperature Range  Rated for operation from −55 °C to +105 °C with an endurance rating of 1000 hours at 105 °C.
• Ripple Performance  Specified ripple current: 37 mA at 120 Hz and 55.5 mA at 10 kHz, with frequency coefficients defined in the datasheet.
• Surface-Mount Chip Package  Compact radial can SMD package with dimensions L: 5.8 × D: 6.3 mm and recommended land size L: 6.6 × W: 6.6 mm.
• Assembly Friendly  Designed for automatic mounting machines and carrier-tape feeding to support high-volume SMD production.
• Compliance & Qualification  RoHS compliant and AEC‑Q200 qualified for use in regulated and automotive applications.

Typical Applications

• Automotive Electronics  Suitable for automotive modules where AEC‑Q200 qualification and elevated-temperature endurance are required.
• High‑Density SMD Power Circuits  Compact chip package fits tight layouts for local decoupling and energy storage on dense PCBs.
• Automated Assembly Lines  Carrier-tape compatibility and SMD form factor streamline placement in automated production environments.
• High‑Temperature Environments  Endurance rating of 1000 hours at 105 °C makes it appropriate for designs exposed to elevated operating temperatures.

Unique Advantages

• AEC‑Q200 Qualification: Provides assurance for use in automotive and other regulated applications that require component qualification.
• Wide Operating Temperature: −55 °C to +105 °C rating supports designs that must tolerate extreme thermal conditions.
• Bi‑Polar Flexibility: Eliminates polarity constraints, simplifying design choices for AC‑coupling or circuits with potential polarity reversal.
• Compact SMD Footprint: Small L: 5.8 × D: 6.3 mm package and defined land pattern optimize PCB area without sacrificing capacitance.
• Production Ready: Tape-fed compatibility and SMD chip form help reduce assembly time and improve manufacturing yield.
• Documented Endurance: 1000 hours at 105 °C with specified limits for capacitance change, tan δ, and leakage current support long-term reliability planning.

Why Choose UUP0J330MCL1GS?

The UUP0J330MCL1GS combines a bi‑polar aluminum electrolytic construction with a compact SMD chip package to deliver reliable capacitance in space-constrained, high-temperature designs. Its AEC‑Q200 qualification and RoHS compliance make it an appropriate choice for automotive and industrial applications that demand both regulatory adherence and thermal endurance.

This part is ideal for engineers and buyers specifying components for high-density PCBs, automated assembly, and environments that require sustained performance at elevated temperatures. Backed by Nichicon’s UUP series specifications, it offers verifiable endurance and ripple characteristics to support long-term design planning.

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