UUP1A330MCL1GS

The UUP1A330MCL1GS is a chip‑type, bi‑polarized aluminum electrolytic capacitor designed for surface mounting on high‑density printed circuit boards. It delivers 33 µF capacitance at a 10 V rating in a compact SMD can package, targeting automotive and other demanding embedded applications that require wide temperature operation and robust endurance.

Key Features

• Bi‑Polarized Electrolytic Core — Eliminates polarity constraints for AC coupling and bipolar circuit applications while providing the bulk capacitance of aluminum electrolytics.
• Compact SMD Can Package — Radial, can‑style SMD package with overall dimensions L: 5.8 × D: 6.3 mm and recommended land size L: 6.6 × W: 6.6 mm for high‑density PCB layouts.
• Automated Assembly Ready — Applicable to automatic mounting machines fed with carrier tape for efficient surface‑mount production.
• Wide Operating Temperature — Rated for −55 °C to +105 °C to support designs exposed to broad environmental ranges.
• Endurance Tested — Specified for 1000 hours at 105 °C (endurance conditions per datasheet), supporting long‑term reliability under elevated temperature stress.
• Ripple Current Performance — Specified ripple current of 41 mA at 120 Hz and 61.5 mA at 10 kHz to address AC and high‑frequency use cases.
• Tolerance and Loss Characteristics — Capacitance tolerance ±20% and datasheet‑specified tan δ values for 10 V rating (tan δ max. 0.20 at 120 Hz, 20 °C).
• Compliance and Qualification — RoHS compliant and AEC‑Q200 qualified, supporting use in regulated and reliability‑sensitive programs.

Typical Applications

• Automotive Electronics — Bulk decoupling and AC coupling in control modules and sensor interfaces where AEC‑Q200 qualification and wide temperature range are required.
• Power Management — Local energy storage and ripple filtering on compact power rails and DC‑DC converter outputs in space‑constrained designs.
• High‑Density PCB Assemblies — Surface‑mount capability and carrier‑tape compatibility make it suitable for automated assembly of dense boards.

Unique Advantages

• Bi‑polar flexibility: Supports circuits without polarity constraints, simplifying AC‑coupled and bidirectional designs.
• Automated assembly friendly: Carrier‑tape compatibility and SMD can package reduce assembly time and BOM handling complexity.
• Wide environmental tolerance: −55 °C to +105 °C rating and 1000‑hour endurance at 105 °C improve robustness in harsh operating conditions.
• Industry qualification: AEC‑Q200 qualification and RoHS compliance provide traceable suitability for regulated and automotive use cases.
• Small PCB footprint: Compact 5.8 × 6.3 mm package and defined land pattern help maximize board real estate for dense designs.
• Frequency‑aware ripple handling: Specified ripple current values at 120 Hz and 10 kHz allow designers to size decoupling for both low and higher frequency loads.

Why Choose UUP1A330MCL1GS?

The UUP1A330MCL1GS combines bi‑polar aluminum electrolytic capacitance with a compact SMD can package and proven endurance characteristics, making it a practical choice for engineers designing compact, reliability‑focused systems. Its AEC‑Q200 qualification and RoHS compliance align with regulated program requirements, while the wide temperature range and specified ripple performance support demanding automotive and industrial environments.

This part is well suited to designers who need bulk capacitance in a small surface‑mount form factor, require bipolar operation, and demand component qualification for long‑term field performance.

Request a quote or submit an inquiry to our sales team to discuss availability, lead times, and volume pricing for UUP1A330MCL1GS.