UUR0G152MNL1GS
| Part Description |
1500 µF 4 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,601 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UUR |
| Manufacturer | Nichicon |
| Manufacturing Status | End Of Life |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 1.5 mF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 1.05 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 85°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 85°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 451.1 mA @ 10 kHz | Ripple Current Low Frequency | 347 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 10 mm | Surface Mount Land Size | N/A | ||
| Tolerance | -20%~20% | Voltage | 4 V |
Overview of UUR0G152MNL1GS – Chip Type Aluminum Electrolytic Capacitor, 1.5 mF, 4 V, SMD, AEC-Q200
The UUR0G152MNL1GS is a chip‑type aluminum electrolytic capacitor offering high capacitance in a compact surface‑mount package. It is designed for high‑density PC boards and automated assembly using carrier tape, providing 1.5 mF rated capacitance at 4 V for applications that require large bulk energy storage at low voltage.
Engineered to meet AEC‑Q200 and RoHS requirements, this part is suited for automotive and other demanding environments where proven electrical endurance and controlled temperature performance are required.
Key Features
- Core Type & Capacitance Chip‑type aluminum electrolytic construction delivering 1.5 mF rated capacitance for bulk decoupling and energy storage.
- Rated Voltage & Tolerance 4 V rated voltage with capacitance tolerance of −20% to +20% for predictable low‑voltage system design.
- Package & Mounting Surface‑mount radial can (SMD) package, compatible with automatic mounting machines fed by carrier tape, optimized for high‑density PCB layouts. Size: L 1 cm × D 1 cm.
- Electrical Performance Ripple current handling specified at 347 mA (120 Hz) and 451.1 mA (10 kHz), enabling effective smoothing under varying frequency conditions.
- Reliability & Standards AEC‑Q200 rated and RoHS compliant; rated operating temperature −40°C to +85°C with a specified life of 2000 hours at 85°C.
- Polarized Polarized capacitor suitable for DC power rail applications.
Typical Applications
- Automotive Electronics Bulk energy storage and power rail smoothing in automotive modules where AEC‑Q200 qualification is required.
- High‑Density PCB Power Management Local energy reservoir and decoupling on compact, densely populated surface‑mount boards.
- Automated Assembly Environments Designed for carrier‑tape feed and placement by automatic mounting machines to streamline high‑volume manufacturing.
Unique Advantages
- High Capacitance in Compact SMD 1.5 mF capacity in a 1 cm × 1 cm SMD can reduces board area for bulk storage compared with larger through‑hole devices.
- Automatable Packaging Carrier‑tape compatibility enables reliable placement in automated assembly lines, reducing manual handling.
- AEC‑Q200 Qualified Built to AEC‑Q200 standards to address reliability expectations in automotive and similarly demanding environments.
- Temperature and Endurance Specified Operates from −40°C to +85°C with a defined 2000‑hour lifetime at 85°C, providing predictable degradation and design margins.
- Frequency‑Aware Ripple Performance Specified ripple currents at both 120 Hz and 10 kHz to aid selection for filtering and smoothing across common power frequencies.
- Regulatory Compliance RoHS compliance supports environmental and regulatory requirements for modern electronics designs.
Why Choose UUR0G152MNL1GS?
UUR0G152MNL1GS is positioned for designs that need substantial low‑voltage bulk capacitance in a surface‑mount form factor—particularly where automotive‑grade qualification and automated assembly compatibility are priorities. Its combination of high capacitance, defined ripple current characteristics, and AEC‑Q200 rating makes it a practical choice for engineers specifying robust power‑management components for compact systems.
This part is suitable for design teams and procurement focused on reliable, compact energy storage solutions for high‑density PCBs that require documented temperature endurance and regulatory compliance.
Request a quote or contact sales to discuss availability, lead times, and pricing for UUR0G152MNL1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016