UUR0G471MCL1GS

The UUR0G471MCL1GS is a chip-type aluminum electrolytic capacitor offering high capacitance in a compact surface-mount radial can package. It is designed for surface mounting on high‑density PC boards and is compatible with automatic mounting using carrier tape.

Targeted for automotive and other demanding electronic assemblies, this part combines 470 µF capacitance at 4 V with AEC‑Q200 compliance and RoHS conformity to support reliable power filtering and energy storage in space-constrained designs.

Key Features

• Capacitance & Voltage — 470 µF rated capacitance at 4 V with ±20% tolerance, suitable for bulk decoupling and energy buffering in low-voltage designs.
• Package & Mounting — Chip-type radial can SMD designed for surface mounting on high‑density PC boards and applicability to automatic mounting machines fed with carrier tape.
• Operating Range & Endurance — Specified operating temperature of -40°C to +85°C and rated for 2000 hours at 85°C under rated voltage conditions for endurance performance.
• Automotive-Grade Reliability — AEC‑Q200 compliant, providing qualification for automotive electronic applications where that standard is required.
• Electrical Characteristics — Leakage current after 1 minute at 20°C is specified as not more than 0.03CV (µA); measured tan δ at 120 Hz and 20°C is specified (for 4 V: tan δ ≤ 0.35).
• Ripple Current Capability — Rated ripple current of 200 mA at 120 Hz and 260 mA at 10 kHz for handling AC components on DC rails.
• Size — Compact footprint with dimensions L: 7.7 × D: 6.3 mm to support high capacitance density in small assemblies.
• RoHS Compliant — Conforms to RoHS directive (2011/65/EU,(EU)2015/863).

Typical Applications

• Automotive Electronics — Power supply smoothing, decoupling, and energy storage in automotive modules where AEC‑Q200 compliance is required.
• Compact Power Modules — Bulk decoupling and local energy buffering on high‑density surface-mount PCBs for power regulation circuits.
• Automated Assembly Lines — Designed for pick-and-place and tape-fed automated mounting processes to streamline production of high-volume assemblies.

Unique Advantages

• High Capacitance in a Small Footprint — 470 µF in a 7.7 × 6.3 mm package enables significant energy storage without a large board area.
• Automotive-Grade Qualification — AEC‑Q200 compliance supports deployment in automotive electronic systems that require industry-standard component qualification.
• Designed for Automated SMT — Carrier-tape compatibility and chip-type SMD packaging reduce assembly complexity and improve manufacturability.
• Endurance at Elevated Temperature — Rated for 2000 hours at 85°C under rated voltage, offering predictable performance under prolonged thermal stress.
• Measured Electrical Limits — Defined leakage current (≤ 0.03CV µA after 1 minute) and specified tan δ at 120 Hz provide clear electrical expectations for design verification.
• Broad Operating Temperature — Specified operation from -40°C to +85°C for deployments across a wide temperature range.

Why Choose UUR0G471MCL1GS?

UUR0G471MCL1GS delivers high capacitance per footprint in a chip-type aluminum electrolytic SMD package engineered for high-density PCB layouts and automated assembly. With AEC‑Q200 compliance, defined endurance at 85°C, and measurable electrical characteristics (leakage and tan δ), it is positioned for designs that require reliable bulk capacitance and predictable performance in temperature-constrained environments.

This part is suited to engineers and procurement teams specifying compact power filtering and energy storage solutions for automotive and industrial surface-mount assemblies where component-level qualification and assembly compatibility are important.

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