UUT1C330MCL1GS

The UUT1C330MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density printed circuit boards. It delivers 33 µF at a 16 V rating in a compact SMD can package optimized for automated assembly.

Targeted at demanding electronics environments, this part provides a wide operating temperature range and a defined load-life performance, making it suitable for automotive and other applications that require AEC-Q200-rated components and RoHS compliance.

Key Features

• Core Electrical — 33 µF nominal capacitance with ±20% tolerance and a rated voltage of 16 V; polarized aluminum electrolytic construction.
• Temperature & Lifetime — Operating range from -55 °C to +105 °C with a rated load life of 2000 hours at +105 °C.
• Ripple Current Performance — Specified ripple handling of 40 mA at 120 Hz and 60 mA at 10 kHz for smoothing and filtering roles.
• Package & Mounting — Chip-type radial can in an SMD footprint: component size L: 5.8 × D: 6.3 mm and recommended land size L: 6.6 × W: 6.6 mm; compatible with carrier-tape automatic mounting.
• Reliability & Compliance — AEC-Q200 compliant and RoHS (2011/65/EU, (EU)2015/863) compliant for regulated markets.
• Leakage Characteristic — Leakage current specified as not more than 0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20 °C.

Typical Applications

• Automotive electronics — Suited for use in automotive modules where AEC-Q200 compliance and a wide temperature range are required.
• High-density PCB assemblies — Chip-style SMD can package and small footprint enable use on compact, densely populated boards.
• Automated surface-mount production — Compatible with carrier-tape feed for placement on automated pick-and-place equipment.

Unique Advantages

• AEC-Q200 compliance: Provides a recognized qualification level for automotive and similarly demanding applications.
• Defined high-temperature endurance: 2000 hours at +105 °C provides a measurable lifetime parameter for thermal stress planning.
• Compact SMD chip format: Small 5.8 × 6.3 mm component size conserves board area on high-density designs.
• Manufacturing-friendly: Carrier-tape compatiblity supports automated, high-volume surface-mount assembly.
• Regulatory readiness: RoHS compliance aligns the part with environmental regulatory requirements.

Why Choose UUT1C330MCL1GS?

UUT1C330MCL1GS combines a compact SMD chip form factor with specifications that address thermal endurance and automotive-oriented reliability. Its AEC-Q200 compliance, RoHS conformity, and defined ripple and leakage characteristics make it suitable for engineers specifying components for robust, high-density electronic assemblies.

Choose this part when you need a small, qualified aluminum electrolytic capacitor that supports automated assembly and offers defined performance across -55 °C to +105 °C. Note: this product is scheduled for discontinuation and is not recommended for new designs.

For availability, lead-time details or to request a quote, please contact sales to discuss current stock and ordering options.