UUT1C470MCL1GS

The UUT1C470MCL1GS is a surface-mount aluminum electrolytic capacitor in a compact radial can (chip) package, offering 47 µF capacitance at 16 V with ±20% tolerance. It is designed for high-density PC boards and is supplied in embossed carrier taping for automated placement.

Key electrical and reliability attributes include a tangent of loss angle (tanδ) of 0.20 at 20°C/120 Hz, low-frequency ripple current rating of 50 mA (120 Hz) and high-frequency ripple current rating of 75 mA (10 kHz), leakage current of 7.52 µA, and a load life of 2000 hours at 105°C. The part is AEC‑Q200 rated and RoHS compliant.

Key Features

• Capacitance & Voltage — 47 µF rated capacitance at 16 V with ±20% tolerance for decoupling and energy storage in compact designs.
• Loss Characteristics — Tangent of loss angle (tanδ) of 0.20 measured at 20°C and 120 Hz, enabling predictable AC performance at the rated voltage.
• Ripple Handling — Rated ripple currents of 50 mA at 120 Hz (low frequency) and 75 mA at 10 kHz (high frequency) for mixed-frequency power environments.
• Reliability & Endurance — Rated for 2000 hours at 105°C, with leakage current specified at 7.52 µA, supporting demanding thermal conditions.
• Automotive Qualification — AEC‑Q200 rating and an operating temperature range of −55°C to +105°C for service in automotive-grade applications.
• Surface-Mount Package — Chip-type radial can SMD, size Ø6.3 × 5.8 mm, supplied in embossed carrier taping for automated pick-and-place mounting.

Typical Applications

• Automotive Electronics — AEC‑Q200 rating and −55°C to +105°C capability make this capacitor suitable for use in automotive modules and control units.
• High‑Density PCB Designs — Compact chip-style radial can and surface-mount format are intended for tight board layouts and space-constrained assemblies.
• Automated Assembly — Embossed carrier taping enables reliable feeding into automatic mounting equipment for volume production.

Unique Advantages

• Automotive‑grade reliability: AEC‑Q200 rating combined with a 2000-hour life at 105°C addresses long-term performance requirements in harsh environments.
• Wide operating temperature: −55°C to +105°C supports use across a broad range of environmental conditions.
• Compact SMD form factor: Ø6.3 × 5.8 mm chip package minimizes board footprint while maintaining electrolytic capacitance density.
• Predictable AC performance: Specified tanδ at 120 Hz and measured ripple current values give clear parameters for power-filtering design decisions.
• Production-friendly packaging: Embossed carrier taping is compatible with automated placement to streamline assembly and reduce handling variability.
• RoHS compliant: Conforms to RoHS requirements for lead-free manufacturing environments.

Why Choose UUT1C470MCL1GS?

UUT1C470MCL1GS combines compact surface-mount packaging with automotive-grade qualification and a documented endurance of 2000 hours at 105°C, making it a practical choice for engineers specifying electrolytic bulk or decoupling capacitance in space-constrained, temperature-challenging applications. Its defined electrical characteristics—47 µF at 16 V, measurable tanδ, ripple current ratings, and controlled leakage—provide clear design parameters for reliable power management.

This part suits teams developing board-level solutions that require a balance of capacitance, thermal endurance, and automated assembly readiness, supported by RoHS compliance and AEC‑Q200-level qualification.

Request a quote or submit an inquiry to discuss pricing and availability for UUT1C470MCL1GS and to verify suitability for your design requirements.