UWD0J560MCL1GS
| Part Description |
56 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 815 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 56 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.1 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 760 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 150 mA @ 10 kHz | Ripple Current Low Frequency | 75 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 5 mm | Surface Mount Land Size | 5.3 x 5.3 mm | ||
| Tolerance | -20%~20% | Voltage | 6.3 V |
Overview of UWD0J560MCL1GS – 56 µF, 6.3 V Low‑Impedance SMD Aluminum Electrolytic Capacitor
The UWD0J560MCL1GS from Nichicon is a chip‑type aluminum electrolytic capacitor engineered for surface‑mount applications that require high temperature reflow compatibility and stable performance across a wide temperature range. It delivers 56 µF at 6.3 V with low impedance characteristics and is designed for automated placement on high‑density PCBs.
Targeted market segments include automotive and industrial electronics where AEC‑Q200 qualification, RoHS compliance, and robust thermal and endurance performance (operating range −55 °C to +105 °C, 2000 hours at 105 °C) are required.
Key Features
- Capacitance & Voltage — 56 µF rated capacitance at 6.3 V for power‑supply decoupling and bulk energy storage in compact SMD designs.
- Low Impedance — Specified impedance of 760 mΩ to support stable filtering and transient suppression in DC‑DC converters and power rails.
- High‑Temperature Reflow Compatibility — Chip type designed to withstand 260 °C peak reflow (recommended: 260 °C peak for 5 s, 230 °C over 60 s) for lead‑free assembly processes.
- Temperature Range & Endurance — Operating range −55 °C to +105 °C with a rated lifetime of 2000 hours at 105 °C, suitable for extended elevated‑temperature operation.
- Ripple Current Ratings — 75 mA at 120 Hz and 150 mA at 10 kHz to accommodate both low‑ and high‑frequency ripple loads.
- Compact SMD Package — Radial can SMD chip package with body dimensions L: 5.8 × D: 5 mm and recommended land size L: 5.3 × W: 5.3 mm for high‑density PCB layouts.
- Reliability & Compliance — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting regulated and safety‑conscious product development.
- Leakage Current Specification — Leakage limited to 0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20 °C, aiding predictable bias behavior in power circuits.
Typical Applications
- Automotive power modules — Local decoupling and bulk storage in in‑vehicle power supplies and control modules where AEC‑Q200 qualification and high temperature operation are required.
- DC‑DC converters — Input/output filtering and transient energy support in compact SMD power stages benefitting from low impedance and defined ripple current ratings.
- Industrial control electronics — Bulk filtering and smoothing in controllers and sensor interface circuits operating across −55 °C to +105 °C.
- High‑density PCB assemblies — Surface‑mount chip format and tape‑feed compatibility for automated placement in space‑constrained designs.
Unique Advantages
- High‑temperature assembly ready — Rated for 260 °C peak reflow enabling compatibility with modern lead‑free solder processes and multi‑pass reflow.
- Automotive‑grade reliability — AEC‑Q200 qualification provides design assurance for automotive and other high‑reliability applications.
- Compact, board‑friendly footprint — Small L:5.8 × D:5 mm package and defined land size simplify placement in dense layouts and automated manufacturing.
- Predictable ripple handling — Specified ripple current values at 120 Hz and 10 kHz let engineers size capacitors for real operating conditions.
- Long elevated‑temperature life — 2000 hours at 105 °C supports sustained operation in hot environments, reducing maintenance and replacement frequency.
- Regulatory compliance — RoHS conformity helps meet environmental requirements for modern electronics deployments.
Why Choose UWD0J560MCL1GS?
UWD0J560MCL1GS balances compact SMD packaging with low impedance and high‑temperature assembly compatibility, making it well suited for designs that require predictable power filtering under thermal and mechanical stress. With AEC‑Q200 qualification, defined ripple ratings, and a proven leakage specification, it is positioned for designs where reliability and manufacturability are priorities.
Choose this Nichicon UWD part for automotive and industrial applications that demand a small footprint, robust elevated‑temperature endurance, and compatibility with automated SMT assembly and lead‑free reflow processes.
If you need pricing, availability, or application guidance, request a quote or contact our sales team for assistance and to obtain a formal quote for UWD0J560MCL1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016