UWD0J330MCL1GS

The UWD0J330MCL1GS is a surface-mount, chip-type aluminum electrolytic capacitor from Nichicon's UWD series designed for high-temperature reflow processes. It combines low impedance characteristics with a compact SMD can package to support dense board layouts and automated carrier-tape assembly.

Engineered for robust operation up to +105°C and AEC-Q200 qualified, this 33 µF, 6.3 V polarized capacitor is targeted at automotive and board-level power applications that require reliable decoupling, smoothing and bulk energy storage in elevated-temperature environments.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance at a rated voltage of 6.3 V, with ±20% tolerance for predictable filtering and decoupling performance.
• Low Impedance Performance — Low-impedance construction with a specified impedance of 760 mΩ; suitable for reducing ripple and improving transient response in power rails.
• High-Temperature Endurance — Rated for operation from −55°C to +105°C with a guaranteed lifetime of 2000 hours at +105°C, supporting long-term reliability in elevated-temperature applications.
• 260°C Peak Reflow Compatibility — Designed to withstand high-temperature reflow soldering; recommended reflow condition: 260°C peak for 5 seconds, and 230°C for over 60 seconds (two cycles specified in series documentation).
• Ripple Current Handling — Specified ripple current: 75 mA at 120 Hz and 150 mA at 10 kHz, enabling effective AC ripple smoothing across a range of frequencies.
• Surface-Mount Chip Package — Radial can SMD chip type suitable for automated placement from carrier tape; recommended PCB land size 5.3 × 5.3 mm to match the component footprint.
• Automotive-Grade Qualification — AEC-Q200 qualified and RoHS compliant, aligning with automotive and regulated-industry requirements.
• Low-Temperature Impedance Stability — At the 6.3 V rating, impedance ratios are specified (Z(−25°C)/Z(+20°C) = 3 and Z(−55°C)/Z(+20°C) = 5) to characterize performance in cold conditions.

Typical Applications

• Automotive electronics — Board-level decoupling and bulk filtering in control units and sensor modules where AEC-Q200 qualification and elevated-temperature endurance are required.
• Embedded power supplies — Smoothing and energy storage for low-voltage DC-DC converters and post-regulator stages on compact, densely populated PCBs.
• Industrial and harsh-environment systems — Power filtering and transient suppression in equipment exposed to wide temperature ranges, leveraging the −55°C to +105°C operating window.

Unique Advantages

• High-temperature reflow ready: Explicitly designed to withstand 260°C peak reflow conditions, simplifying assembly on modern lead-free production lines.
• AEC-Q200 qualification: Provides documented suitability for automotive applications, helping streamline design-in for vehicle electronics.
• Low impedance for improved power integrity: 760 mΩ nominal impedance and frequency-aware ripple current specifications reduce voltage ripple and support stable power delivery.
• Compact SMD chip format: Chip-type radial can enables automated placement and efficient use of board area on high-density PCBs with recommended land size 5.3 × 5.3 mm.
• Wide operating temperature range: −55°C to +105°C rating supports deployments across a broad set of thermal environments.
• Durability at elevated temperature: Rated for 2000 hours at +105°C, providing a measurable endurance baseline for long-term designs.

Why Choose UWD0J330MCL1GS?

UWD0J330MCL1GS delivers a combination of low impedance, compact SMD packaging and high-temperature process compatibility that makes it a practical choice for designers needing reliable board-level capacitance in demanding environments. With AEC-Q200 qualification and RoHS compliance, it supports regulated and automotive-grade implementations while maintaining predictable electrical behavior across temperature and frequency.

This part is well suited for engineers specifying decoupling and smoothing components for embedded power systems, automotive electronics, and industrial controls where automated assembly, thermal endurance and low-impedance performance matter. Its documented ripple current ratings, impedance characteristics at low temperature, and reflow compatibility provide clear, verifiable data for design and qualification workflows.

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