UWD0J152MCL1GS

The UWD0J152MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly on high-density PCBs. It delivers 1500 µF of capacitance at 6.3 V with low impedance and packaged for automated placement.

Targeted at demanding electronic systems, this part offers high-temperature reflow compatibility, AEC-Q200 qualification and long endurance (5,000 hours at 105°C), making it suited to robust designs where compact bulk capacitance, ripple handling and thermal reliability are required.

Key Features

• Capacitance & Voltage — 1500 µF nominal capacitance at a rated voltage of 6.3 V with ±20% tolerance for bulk energy storage and smoothing.
• Low Impedance — Specified impedance of 90 mΩ for improved ripple performance and reduced voltage drop under load; tan δ (tanδ max. 0.26 at 20°C, 120 Hz) for loss characterization.
• Ripple Current Capability — Low-frequency ripple current 335 mA (120 Hz) and high-frequency ripple current 670 mA (10 kHz) to support switching supplies and decoupling tasks.
• High Thermal Endurance — Rated operating range −55°C to +105°C with endurance specified as 5000 hours at 105°C, supporting sustained high-temperature operation.
• High-Temperature Reflow Compatible — Designed for 260°C peak reflow soldering (recommended peak 260°C for 5 s; 230°C over 60 s), enabling modern assembly processes.
• Automotive-Grade Qualification — AEC-Q200 qualified for applications requiring automotive-level component qualification.
• Compact SMD Package — Chip-type radial can SMD in φ10 × 10 mm dimensions with surface-mount land size L: 1.03 × W: 1.03 cm for dense board layouts.
• Low Leakage — Specified leakage current of 94.5 µA for predictable standby behavior and power management.
• Packaging & Compliance — Supplied in embossed carrier taping for automatic mounting; RoHS compliant.

Typical Applications

• Automotive Electronics — Bulk smoothing and decoupling in control modules, leveraging AEC-Q200 qualification and 5000 h endurance at 105°C.
• Power Supply Filtering — Energy buffering and output smoothing in DC–DC converters and regulator outputs where 1500 µF bulk capacitance and low impedance are required.
• High-Density PCB Designs — Surface-mount chip configuration and embossed carrier taping enable automated placement on compact boards needing substantial capacitance.

Unique Advantages

• High bulk capacitance in an SMD form factor: 1500 µF in a φ10 × 10 mm chip-type package reduces board area compared with through-hole equivalents.
• Assembly-friendly reflow profile: Compatibility with 260°C peak reflow simplifies integration into modern SMT manufacturing flows.
• Designed for sustained elevated temperatures: 5000-hour endurance at 105°C provides long-term stability in high‑temperature environments.
• Measurable ripple handling: Specified LF and HF ripple currents (335 mA @120 Hz, 670 mA @10 kHz) enable straightforward thermal and performance budgeting.
• Automotive-ready qualification: AEC-Q200 rating supports use in applications that require automotive-grade component qualification.
• RoHS-compliant supply in tape packaging: Embossed carrier taping supports automated placement while meeting environmental compliance requirements.

Why Choose UWD0J152MCL1GS?

UWD0J152MCL1GS combines high capacitance, low impedance and automotive-grade qualification in a compact chip-type SMD package engineered for modern assembly processes. Its specified ripple currents, low leakage and long endurance at elevated temperature make it a reliable choice for designs that need stable bulk capacitance and thermal robustness.

This part is well suited for engineers specifying capacitors for automotive electronics, power supply filtering and dense PCB layouts where automated placement and consistency across production are important. The combination of AEC-Q200 qualification, reflow compatibility and embossed carrier taping supports both design reliability and manufacturability.

For pricing, availability or to request a quote for UWD0J152MCL1GS, please contact our sales team or submit a request through your preferred procurement channel.