UWD0J221MCL1GS

The UWD0J221MCL1GS from Nichicon is a chip‑type aluminum electrolytic capacitor engineered for surface‑mount use on high‑density PC boards. It delivers 220 µF at 6.3 V in a low‑impedance SMD can designed for automated assembly and elevated‑temperature processing.

Key value propositions include compatibility with 260°C peak reflow processes, AEC‑Q200 qualification for automotive applications, and rated operation from -55°C to +105°C—making it suitable for demanding, compact power designs that require robust performance and reliable mounting.

Key Features

• Core performance — 220 µF nominal capacitance at 6.3 V with ±20% tolerance and polarization for bulk energy storage and decoupling.
• Low impedance — Specified impedance of 440 mΩ, supporting improved ripple handling and transient response in power rails.
• Ripple current — Rated for 115 mA at 120 Hz and 230 mA at 10 kHz to support AC superposition and switching applications.
• High‑temperature operation — Category temperature range from -55°C to +105°C with endurance specified as 2000 hours at 105°C.
• High‑temperature reflow compatibility — Designed for 260°C peak reflow soldering; recommended reflow condition: 260°C peak for 5 seconds and 230°C over 60 seconds (general guidance included in datasheet).
• Reliability and compliance — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), with leakage current limits defined per datasheet (≤0.01CV or 3 µA after 2 minutes at 20°C).
• SMD package for automated assembly — Radial can SMD package sized L: 5.8 × D: 6.3 mm with recommended land size 6.6 × 6.6 mm; compatible with carrier‑tape fed automatic mounting machines.

Typical Applications

• Automotive electronics — Suitable for automotive electronic modules where AEC‑Q200 qualification and elevated operating temperatures are required.
• High‑density power rails — Bulk smoothing and decoupling on compact, surface‑mount PCBs where low impedance and high capacitance in a small footprint are needed.
• Automated production — Designed for pick‑and‑place assembly from carrier tape and reflow soldering up to 260°C peak, supporting high‑volume manufacturing.

Unique Advantages

• Reflow‑friendly construction — With documented 260°C peak reflow capability, the capacitor supports modern lead‑free soldering workflows without special handling.
• Automotive‑grade qualification — AEC‑Q200 qualification provides defined reliability expectations for automotive system designers.
• Compact SMD can — 5.8 × 6.3 mm package provides high capacitance in a small board footprint, enabling space savings on dense PCBs.
• Thermal endurance — Rated for 2000 hours at 105°C, supporting sustained operation in elevated-temperature environments.
• Measured ripple capability — Specified ripple current at both low and high frequencies helps in selecting a capacitor that meets switching‑converter and filtering needs.
• Regulatory compliance — RoHS directive compliance simplifies inclusion in regulated products and global supply chains.

Why Choose UWD0J221MCL1GS?

UWD0J221MCL1GS is positioned for designs that require a compact, low‑impedance aluminum electrolytic capacitor capable of withstanding modern lead‑free reflow processes and elevated operating temperatures. Its combination of 220 µF capacitance, 6.3 V rating, AEC‑Q200 qualification, and specified endurance at 105°C makes it suitable for engineers specifying robust SMD bulk capacitors for automotive and industrial power applications.

Backed by Nichicon’s technical specifications and compliance details, this part offers a verifiable option for production environments that demand automated assembly compatibility and predictable long‑term behavior under thermal stress.

If you would like pricing, availability, or to request a quote for UWD0J221MCL1GS, please contact our sales team to discuss your requirements and lead times.