UWD0J270MCL1GS

The UWD0J270MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor in a compact surface-mount can (φ4 × 5.8 mm). It delivers 27 µF at 6.3 V with low leakage and defined ripple current capability for dense PCB power designs.

Designed for high-temperature reflow processes and AEC-Q200 qualification, this part targets automotive and other high-reliability applications that require surface-mount power decoupling in a small footprint and broad temperature range (−55°C to +105°C).

Key Features

• Capacitance & Voltage — 27 µF nominal capacitance with a rated voltage of 6.3 V and ±20% tolerance (120 Hz, 20°C).
• Low Impedance — Specified impedance of 1.8 Ω supports effective filtering and decoupling at the part’s rated conditions.
• Ripple Current Ratings — Low-frequency ripple current 40 mA (120 Hz) and high-frequency ripple current 80 mA (10 kHz) for real-world power applications.
• Leakage Current — Low leakage current of 3 µA after rated-voltage application, supporting stable bias performance.
• Thermal & Endurance — Operating range −55°C to +105°C with rated endurance of 2000 hours at 105°C (for φD = 4 mm designs).
• High-Temperature Reflow Compatibility — Compatible with recommended peak reflow conditions up to 260°C (260°C peak, 5 s; 230°C over 60 s), enabling lead-free SMT assembly processes.
• Package & Assembly — Chip-type radial can in an SMD package (φ4 × 5.8 mm) supplied in embossed carrier taping suitable for automatic placement.
• Qualification & Compliance — AEC-Q200 qualified and RoHS compliant, supporting use in regulated, reliability-focused designs.

Typical Applications

• Automotive Control Modules — AEC-Q200 qualification, −55°C to +105°C operation and 2000 h endurance at 105°C make this capacitor suitable for on-board power decoupling in automotive electronics.
• Compact Power and Decoupling on High-Density PCBs — Small φ4 × 5.8 mm can and embossed carrier taping enable automated placement for space-constrained power rail filtering.
• Surface-Mount Assembly Environments — Compatibility with 260°C peak reflow accommodates lead-free manufacturing processes for modern SMT lines.

Unique Advantages

• Small SMD Can with Solid Capacitance: Provides 27 µF in a φ4 × 5.8 mm package, enabling compact board layouts without sacrificing bulk capacitance.
• Reflow-Ready for Lead-Free Processes: Rated for 260°C peak reflow, simplifying integration into high-temperature SMT assembly flows.
• Defined Ripple and Leakage Performance: Specified ripple currents (40 mA / 80 mA) and low leakage (3 µA) allow predictable behavior in power-supply filtering and decoupling applications.
• Automotive-Grade Reliability: AEC-Q200 qualification and a wide operating temperature range support use in demanding, reliability-focused applications.
• Pick-and-Place Friendly Packaging: Embossed carrier taping supports automated placement for volume manufacturing.

Why Choose UWD0J270MCL1GS?

UWD0J270MCL1GS combines compact SMD packaging with measurable electrical performance—27 µF at 6.3 V, low impedance (1.8 Ω), and defined ripple/leakage characteristics—making it a practical choice for designers needing dependable bulk and decoupling capacitance in tight board spaces. Its compatibility with high-temperature reflow and AEC-Q200 qualification align the component with automotive and other high-reliability manufacturing and field environments.

This capacitor is well suited to engineers and procurement teams specifying components for compact power rails, automotive modules, and automated SMT assembly where predictable endurance and thermal robustness are required.

Request a quote or contact our sales team to discuss pricing, lead times, and volume availability for UWD0J270MCL1GS.