UWD0J151MCL1GS

The UWD0J151MCL1GS from Nichicon is a chip‑type, low‑impedance aluminum electrolytic capacitor in the UWD series designed for surface mounting. It delivers 150 µF at 6.3 V in a compact SMD can (φ6.3 × 5.8 mm) and is optimized for automated assembly and high‑density PCBs.

Key design strengths include high‑temperature reflow compatibility (260°C peak) and a wide operating temperature range of −55°C to +105°C, making it suitable for demanding electronic power and filtering applications where endurance and assembly reliability matter.

Key Features

• Electrical Performance — 150 µF nominal capacitance at 6.3 V with ±20% tolerance; impedance is specified at 440 mΩ and tan δ (DF) is 0.26 measured at 20°C, 120 Hz.
• Ripple Handling — Rated ripple currents of 115 mA (120 Hz) and 230 mA (10 kHz) support smoothing and decoupling in power circuits.
• Low Leakage — Leakage current listed as 9.45 µA (measurement condition per product data), helping reduce standby losses in low‑current designs.
• High‑Temperature Endurance — Lifetime specified as 2000 hours at 105°C; endurance and shelf life characteristics follow the UWD series specifications.
• Reflow & Assembly — Chip‑type construction supports 260°C peak reflow (recommended 260°C peak 5 s; 230°C over 60 s) and is compatible with automatic mounting from embossed carrier tape packaging.
• Mechanical & Package — Compact SMD can package (φ6.3 × 5.8 mm) with recommended land pattern 6.6 × 6.6 mm for tight PCB layouts.
• Qualifications & Compliance — AEC‑Q200 qualified and RoHS compliant, aligning with regulated and automotive development requirements.

Typical Applications

• Automotive Electronics — Used on automotive power rails and control modules where AEC‑Q200 qualification, a wide temperature range, and endurance at 105°C are required.
• DC‑DC Converters and Voltage Regulators — Provides bulk filtering and ripple suppression for compact power supply PCBs thanks to its ripple current ratings and low impedance.
• High‑Density Surface‑Mount Power Boards — Chip‑type SMD package and embossed carrier taping enable automated placement on high component‑density boards.

Unique Advantages

• Compact SMD Form Factor: φ6.3 × 5.8 mm can minimizes board space while providing 150 µF capacitance for bulk and decoupling.
• Reflow‑Ready Construction: Designed for 260°C peak reflow processes to integrate seamlessly with modern SMT assembly flows.
• Automotive‑Grade Qualification: AEC‑Q200 qualification supports use in regulated automotive systems and designs targeting long‑term reliability.
• Robust Thermal Endurance: Rated for 2000 hours at 105°C, providing predictable lifetime performance in elevated temperature environments.
• Balanced Electrical Characteristics: Low impedance (440 mΩ), controlled tan δ (0.26), and specified ripple currents make it suitable for power filtering in constrained layouts.
• RoHS Compliant: Meets RoHS directive requirements for material compliance in regulated markets.

Why Choose UWD0J151MCL1GS?

UWD0J151MCL1GS combines a compact chip‑type SMD package with electrical characteristics tailored for power filtering and decoupling in temperature‑stressed environments. Its 150 µF/6.3 V rating, low impedance, defined ripple current capability, and 2000‑hour endurance at 105°C make it a practical choice for engineers designing dense power subsystems and automotive electronics.

Manufactured by Nichicon as part of the UWD series, this capacitor is positioned for applications that require reflow compatibility, automated placement, and component qualification for demanding environments. It offers a balance of performance and reliability for designs that must meet controlled electrical behavior and long‑term thermal endurance.

If you need pricing, availability, or a formal quote for UWD0J151MCL1GS, request a quote or submit a sales inquiry to discuss lead times and ordering options.