UWD0J101MCL1GS
| Part Description |
100 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,148 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 100 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.1 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 440 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 230 mA @ 10 kHz | Ripple Current Low Frequency | 115 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 6.3 V |
Overview of UWD0J101MCL1GS – Surface‑Mount Aluminum Electrolytic Capacitor, 100 µF / 6.3 V
The UWD0J101MCL1GS is a chip‑type, surface‑mount aluminum electrolytic capacitor from Nichicon’s UWD series designed for board‑level decoupling and power filtering in compact electronics. It combines a 100 µF capacitance and 6.3 V rating with a low‑impedance construction and a broad operating temperature range to support demanding environments.
Targeted for high‑density PCB assembly and automotive electronics, this part offers AEC‑Q200 qualification, RoHS compliance, and compatibility with high‑temperature reflow processes for reliable automated manufacturing.
Key Features
- Core Electricals — 100 µF capacitance at 6.3 V with ±20% tolerance (‑20% to +20%), suitable for bulk decoupling and smoothing at low voltages.
- Low Loss / Impedance — tanδ 0.26 (measured at 20°C, 120 Hz) and an impedance of 440 mΩ, enabling effective AC performance for ripple suppression.
- Ripple Current Capability — Rated low‑frequency ripple current 115 mA (120 Hz) and high‑frequency ripple current 230 mA (10 kHz), supporting switching regulator and power‑stage applications.
- Leakage Current — Specified leakage current of 6.3 µA, allowing predictable bias behavior in battery‑sensitive and standby circuits.
- Reliability & Endurance — 2000 hours endurance at 105°C; meets stability and life requirements for prolonged high‑temperature operation.
- Temperature Range — Rated for operation from ‑55°C to +105°C for wide environmental tolerance.
- Package & Mounting — Compact SMD can: φ6.3 × 5.8 mm, surface‑mount land size 6.6 × 6.6 mm; packaged in embossed carrier taping for automated placement.
- Automotive Grade & Compliance — AEC‑Q200 qualified and RoHS compliant, suitable for automotive electronics and regulated designs.
- Assembly Compatibility — Chip‑type construction designed for high‑temperature reflow soldering (260°C peak reflow compatibility referenced in series data), enabling modern PCB assembly flows.
Typical Applications
- Automotive power modules — Bulk decoupling and smoothing for low‑voltage automotive electronics where AEC‑Q200 qualification and high temperature endurance are required.
- DC‑DC converters — Input/output filtering for compact switching regulators, using the part’s low impedance and defined ripple current ratings.
- Infotainment and telematics — Local energy storage and noise suppression on high‑density PCBs operating across a wide temperature range.
- Industrial control — Power filtering and decoupling in compact control modules exposed to elevated temperatures and continuous operation.
Unique Advantages
- Automotive‑ready qualification: AEC‑Q200 rating provides assurance for use in automotive electronic modules and other safety‑oriented systems.
- High‑temperature endurance: 2000 hours at 105°C supports long life in thermally demanding applications.
- Compact SMD can: φ6.3 × 5.8 mm footprint and embossed carrier taping enable dense board layouts and efficient automated placement.
- Predictable AC performance: Low impedance (440 mΩ), measured tanδ, and specified ripple currents make it straightforward to size for switching and filtering tasks.
- Controlled leakage: Low leakage current (6.3 µA) supports designs with standby or low‑power requirements.
- RoHS compliant: Meets environmental requirements for regulated markets and product lifecycles.
Why Choose UWD0J101MCL1GS?
UWD0J101MCL1GS positions itself as a compact, automotive‑grade surface‑mount capacitor that balances capacitance density, thermal endurance, and specified AC performance. Its combination of 100 µF capacitance, low impedance, and rated ripple currents makes it a practical choice for power supply decoupling and filtering on modern, high‑density PCBs.
This part is well suited to designers of automotive and industrial electronics who need a proven SMD electrolyte solution qualified to AEC‑Q200, capable of enduring elevated temperatures and automated assembly processes while maintaining predictable electrical characteristics over its rated life.
Request a quote or contact sales to discuss availability, tape‑and‑reel packaging options, and integration into your production BOM for UWD0J101MCL1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016