UWD0J331MCL1GS

The UWD0J331MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon’s UWD series, designed for surface-mount use on high-density PC boards. It delivers 330 µF at 6.3 V in a compact radial can SMD package with low impedance and high-temperature reflow compatibility.

Targeted for applications requiring robust thermal and mechanical assembly processes—including automotive electronics—the part pairs AEC-Q200 qualification and RoHS compliance with an operating temperature range of -55 °C to +105 °C.

Key Features

• Capacitance & Voltage 330 µF nominal capacitance at a rated voltage of 6.3 V with ±20% tolerance for bulk energy storage in a small footprint.
• Low Impedance Rated impedance of 340 mΩ, providing improved ripple handling and reduced voltage drop under load.
• Ripple Current Performance Specified ripple currents of 140 mA at 120 Hz and 280 mA at 10 kHz for AC components in real-world switching environments.
• High-Temperature Endurance Operates from -55 °C to +105 °C with a rated lifetime of 2000 hours at 105 °C, consistent with the series endurance specification for this diameter.
• 260 °C Peak Reflow Compatibility Chip-type construction supports 260 °C peak reflow soldering (recommended 260 °C peak for 5 seconds; 230 °C over 60 seconds as noted), enabling modern high-temperature assembly flows.
• Compact SMD Package Radial, can-style SMD with dimensions L: 7.7 × D: 6.3 mm and recommended land pattern L: 6.6 × W: 6.6 mm for high-density PCB layouts and automated placement.
• Automotive-Grade Qualification & Compliance AEC-Q200 qualified and RoHS compliant, supporting deployment in regulated environments and automated carrier-tape assembly.
• Polarized Construction Polarized aluminum electrolytic design for DC bulk and filtering applications where polarity is defined.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and operation to +105 °C make this capacitor suitable for electronic control modules and other automotive subsystems requiring surface-mount bulk capacitance.
• High-Density SMD Assemblies — Compact radial can SMD package and compatibility with automatic placement on carrier tape support high-density PCB designs and automated production.
• High-Temperature Assembly Environments — Designed to withstand 260 °C peak reflow processes and recommended reflow profiles, enabling integration into lead-free, high-temperature manufacturing flows.

Unique Advantages

• High bulk capacitance in a compact SMD package: 330 µF at 6.3 V in a 7.7 × 6.3 mm package conserves board area while providing significant energy storage.
• Low impedance for improved dynamic performance: 340 mΩ impedance reduces voltage ripple and supports transient current demands.
• Engineered for high-temperature assembly: Rated for 260 °C peak reflow with recommended profiles, simplifying integration into modern lead-free manufacturing.
• Automotive-grade qualification: AEC-Q200 rating supports use in regulated automotive electronic designs requiring component-level reliability data.
• Durability at elevated operating temperatures: 2000 hours rated life at 105 °C provides predictable long-term performance in hot environments.
• RoHS compliant: Meets current RoHS requirements for restricted substances, supporting regulatory compliance.

Why Choose UWD0J331MCL1GS?

The UWD0J331MCL1GS combines a high-value capacitance-to-size ratio with low impedance and assembly-ready thermal characteristics, making it a practical choice for engineers designing compact, high-density electronic modules—particularly where automotive-grade reliability and high-temperature reflow compatibility are required. Its AEC-Q200 qualification, 2000-hour life at 105 °C, and carrier-tape compatibility support both robust field performance and efficient automated manufacturing.

Manufactured by Nichicon, this SMD aluminum electrolytic capacitor is positioned for designs that need durable bulk capacitance, predictable long-term behavior at elevated temperatures, and straightforward integration into automated assembly lines.

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