UWD0J681MCL1GS
| Part Description |
680 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 718 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 680 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 1.05 cm | HTS Code | 8532.22.0020 | ||
| Impedance | 170 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 5000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 450 mA @ 10 kHz | Ripple Current Low Frequency | 225 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 8 mm | Surface Mount Land Size | 8.3 x 8.3 mm | ||
| Tolerance | -20%~20% | Voltage | 6.3 V |
Overview of UWD0J681MCL1GS – 680 µF, 6.3 V Chip Aluminum Electrolytic Capacitor (Low Impedance)
The UWD0J681MCL1GS is a surface-mount, chip-type aluminum electrolytic capacitor from Nichicon’s UWD series. It provides 680 µF capacitance at a 6.3 V rating in a compact φ8 × 10 mm can optimized for low impedance and high-temperature reflow processes.
This part targets high-density surface-mount assemblies and applications that require robust ripple handling, long endurance at elevated temperature, and compatibility with automated placement and carrier-tape mounting. It is RoHS compliant and AEC‑Q200 qualified.
Key Features
- Capacitance & Voltage — 680 µF nominal capacitance with ±20% tolerance at 6.3 V rated voltage, specified at 20 °C, 120 Hz.
- Low Impedance Performance — Specified impedance of 170 mΩ and a tangent of loss angle (tan δ) of 0.28 (measured at 20 °C, 120 Hz), supporting effective decoupling and transient response in compact designs.
- Ripple Current Capability — Low-frequency ripple current 225 mA (120 Hz) and high-frequency ripple current 450 mA (10 kHz) for handling both line-frequency and switching noise.
- High-Temperature Endurance — Rated for operation from −55 °C to +105 °C with a 5000 hour endurance at 105 °C, ensuring long-term stability under elevated ambient conditions.
- Leakage & Reliability — Specified leakage current of 42.84 µA and endurance criteria that limit capacitance change and tan δ increase after life testing, consistent with robust operational behavior.
- Reflow & Assembly Ready — Chip-type design compatible with 260 °C peak reflow (recommended reflow condition provided), and supplied in embossed carrier tape for automatic mounting machines.
- Compact Surface-Mount Package — φ8 × 10 mm can (L: 1.0 × D: 0.8 cm) with recommended land pattern 8.3 × 8.3 mm to support high-density PCB layouts.
- Standards & Compliance — RoHS compliant and AEC‑Q200 qualified, addressing regulatory and automotive-grade qualification requirements.
Typical Applications
- Automotive electronic modules — AEC‑Q200 qualification and high-temperature endurance make this capacitor suitable for automotive electronics that require long-term stability at elevated temperatures.
- High-density surface-mount PCBs — Chip-type can and compact φ8 × 10 mm package are designed for use on tightly packed boards where space and placement reliability matter.
- Automated assembly environments — Supplied in embossed carrier taping and compatible with automatic mounting machines for streamlined production and consistent placement.
Unique Advantages
- High ripple tolerance: Specified low‑ and high‑frequency ripple ratings (225 mA at 120 Hz, 450 mA at 10 kHz) enable reliable smoothing and decoupling in mixed-frequency power systems.
- Long-term thermal reliability: 5000‑hour endurance at 105 °C provides predictable electrical performance over extended service life in hot environments.
- Low-loss construction: Low impedance (170 mΩ) and defined tan δ support efficient energy filtering and improved transient response in compact layouts.
- Assembly-ready format: Embossed carrier taping and reflow compatibility simplify automated production flow and reduce manual handling.
- Automotive-capable grading: AEC‑Q200 qualification addresses the needs of applications that require automotive-level component qualification.
- Regulatory compliance: RoHS compliance supports deployment in regulated manufacturing environments.
Why Choose UWD0J681MCL1GS?
UWD0J681MCL1GS combines a high capacitance density (680 µF) with low impedance and defined ripple handling to serve designs that require compact, reliable power decoupling. Its chip-type, surface-mount can package and embossed carrier taping make it suitable for high-density PCBs and automated assembly lines, while endurance at 105 °C and AEC‑Q200 qualification align it with demanding environmental and automotive requirements.
This capacitor is well suited for engineers and procurement teams building robust power subsystems where predictable long-term performance, reflow compatibility, and compliance with industry standards are required.
Request a quote or contact sales to discuss availability, bulk pricing, and lead times for UWD0J681MCL1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016