UWD1A151MCL1GS

The UWD1A151MCL1GS is a surface-mount aluminum electrolytic capacitor in a chip-style can package, offering 150 µF capacitance at a 10 V rating. It is a low-impedance device designed for surface mounting on high-density PCBs and is supplied in embossed carrier taping for automated placement.

Engineered for demanding thermal and endurance environments, the part supports an operating temperature range of −55 °C to 105 °C and a rated endurance of 2000 hours at 105 °C. Key electrical attributes include low impedance (440 mΩ), controlled loss tangent (tanδ = 0.20 at 20 °C, 120 Hz), defined ripple current ratings, and low leakage current.

Key Features

• Capacitance & Voltage — 150 µF nominal capacitance with a rated voltage of 10 V and capacitance tolerance of ±20% (−20% to +20%).
• Low Impedance Performance — Measured impedance of 440 mΩ provides effective smoothing and energy storage in compact applications.
• Loss Tangent (tanδ) — tanδ = 0.20 (max) measured at 20 °C and 120 Hz, supporting predictable AC loss characteristics.
• Ripple Current Capability — Low-frequency ripple current of 115 mA at 120 Hz and high-frequency ripple current of 230 mA at 10 kHz for handling varying ripple conditions.
• Leakage Current — Specified leakage current of 15 µA, enabling low quiescent current profiles in DC circuits.
• Temperature & Endurance — Rated for −55 °C to 105 °C with a lifetime/endurance of 2000 hours at 105 °C (specified for φD = 6.3 mm sizes).
• Package & Mounting — Chip-type radial can for surface mount, dimension φ6.3 × 5.8 mm, and recommended PCB land size 6.6 × 6.6 mm; supplied in embossed carrier taping for automated pick-and-place.
• Assembly Compatibility — Designed for reflow processes with compatibility for elevated peak reflow conditions as documented in manufacturer recommendations.
• Qualification & Compliance — AEC‑Q200 rated and RoHS compliant for regulated environments and designs requiring recognized component-level qualifications.

Typical Applications

• Automotive Electronics — Suitable for automotive electronic modules where AEC‑Q200 qualification and high-temperature endurance are required.
• High‑density Surface‑mount PCBs — Chip-style can and small footprint fit densely populated boards while supporting automated assembly.
• Automated Assembly Lines — Embossed carrier taping enables compatibility with automatic mounting machines for efficient production.

Unique Advantages

• Compact high-capacitance in SMD form: 150 µF in a φ6.3 × 5.8 mm package delivers sizable energy storage without a large board footprint.
• Designed for elevated operating temperatures: Rated to 105 °C with a 2000‑hour endurance rating, supporting durable operation in heated environments.
• Predictable AC behavior: Specified tanδ and impedance values at 120 Hz enable reliable AC loss and ripple performance for power circuits.
• Production-ready packaging: Embossed carrier taping and chip-type form factor streamline automated placement and high-volume manufacturing.
• Industry qualification: AEC‑Q200 rating and RoHS compliance provide traceable qualification and environmental compliance for regulated designs.

Why Choose UWD1A151MCL1GS?

UWD1A151MCL1GS combines compact size, dependable electrical performance, and production-oriented packaging to address space-constrained designs that must meet elevated temperature and qualification requirements. Its low impedance, defined loss characteristics, and ripple handling make it suitable for power stabilization and decoupling in robust embedded systems.

This part is well suited to design teams and procurement focused on durable, automated-manufacture-capable components—especially where AEC‑Q200 qualification, RoHS compliance, and predictable endurance at up to 105 °C are required. The product delivers specific, verifiable specifications to streamline component selection and system validation.

Request a quote or submit an inquiry to check availability, lead times, and pricing for UWD1A151MCL1GS. Our team can provide ordering information and support for volume planning and qualification requirements.