UWD1A330MCL1GS

The UWD1A330MCL1GS is a chip-type aluminum electrolytic capacitor in the Nichicon UWD series, specified at 33 μF and 10 V. It is a low-impedance, surface-mount device designed for high-temperature reflow assembly and operation up to +105°C.

Targeted for automotive and high-density PCB applications, the part combines AEC-Q200 qualification, carrier-tape compatibility for automatic mounting, and endurance ratings appropriate for elevated-temperature environments.

Key Features

• Capacitance & Voltage — 33 μF rated capacitance at 10 V with ±20% tolerance (120 Hz, 20°C).
• Temperature Range — Operates from −55°C to +105°C, with endurance specified at 2000 hours at 105°C for this size.
• Low Impedance — Specified impedance of 760 mΩ, with loss tangent (tan δ) limits defined for the 10 V rating in the series datasheet.
• High-temperature Reflow Compatibility — Corresponds with 260°C peak reflow soldering; recommended reflow condition: 260°C peak for 5 seconds; 230°C over 60 seconds (2 times; φ10 × 10 : 1 time).
• Surface-mount Chip Package — Chip type, radial can SMD designed for surface mounting on high-density PCBs; compatible with automatic mounting machines fed with carrier tape.
• Reliability & Endurance — AEC-Q200 qualified; endurance criteria include capacitance change within ±30% after rated-voltage application for 2000 hours at 105°C for this diameter.
• Ripple Current Ratings — 75 mA at 120 Hz (low frequency) and 150 mA at 10 kHz (high frequency) as specified.
• Compact Footprint — Size: L 5.8 × D 5 mm with surface-mount land size L 5.3 × W 5.3 mm, for dense board layouts.
• Polarized — Polarized aluminum electrolytic design per series characteristics.
• RoHS Compliance — Compliant with RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — For use in automotive electronic modules where AEC‑Q200 qualification and operation to +105°C are required.
• High-density surface-mount assemblies — Intended for compact PCB layouts that require chip-type SMD capacitors and compatibility with automatic mounting machines fed with carrier tape.
• Automotive production environments — Compatible with 260°C peak reflow processes commonly used in automotive PCB assembly; recommended reflow profile is provided in the product datasheet.

Unique Advantages

• AEC‑Q200 Qualification: Provides a documented qualification status for designs that require automotive-grade components.
• High-temperature reflow compatibility: Supports 260°C peak reflow soldering, enabling use with lead‑free, high-temperature assembly processes.
• Designed for dense SMT layouts: Chip-type, small footprint (5.8 × 5 mm) and defined land pattern (5.3 × 5.3 mm) simplify placement on high-density PCBs.
• Endurance at elevated temperature: Rated for 2000 hours at 105°C for this size, with specified limits for capacitance change, tan δ and leakage after endurance testing.
• Measured ripple performance: Specified ripple current values at 120 Hz and 10 kHz help in selecting the capacitor for frequency-specific ripple handling.
• RoHS compliance: Conforms to current RoHS requirements for environmental and regulatory needs.

Why Choose UWD1A330MCL1GS?

UWD1A330MCL1GS delivers a compact, chip-type aluminum electrolytic solution with specifications targeted at high-density, high-temperature assembly and automotive applications. Its combination of 33 μF/10 V rating, low impedance, AEC‑Q200 qualification and defined endurance at +105°C makes it suitable for designs where reliability under thermal stress and automated surface-mount assembly are priorities.

This part is appropriate for engineers and procurement teams specifying components for automotive electronic modules and other assemblies requiring AEC‑Q200-qualified, reflow-compatible capacitors with a small PCB footprint and documented ripple and endurance characteristics.

Request a quote or contact sales to discuss pricing, availability, and sample requests for UWD1A330MCL1GS.