UWD1A221MCL1GS

The UWD1A221MCL1GS is a chip‑type aluminum electrolytic capacitor designed for surface‑mount, high‑density PCB assemblies. It delivers 220 µF of capacitance at a 10 V rating in a compact φ6.3 × 7.7 mm can suitable for automated placement.

Engineered for low impedance and elevated operating temperatures, this part targets applications that require reliable bulk decoupling and ripple handling on 10 V rails, with AEC‑Q200 qualification and RoHS compliance for demanding commercial and automotive markets.

Key Features

• Chip‑type SMD package — φ6.3 × 7.7 mm radial can designed for surface mounting and automated placement; supplied in embossed carrier taping for pick‑and‑place assembly.
• Electrical performance — 220 µF nominal capacitance with ±20% tolerance (120 Hz, 20°C), impedance of 340 mΩ, and leakage current specified at 22 µA.
• Ripple handling — Supports low frequency ripple current of 140 mA (120 Hz) and high frequency ripple current of 280 mA (10 kHz) for smoothing and decoupling duties.
• Thermal and soldering resilience — Operating temperature range −55°C to +105°C and designed to withstand 260°C peak reflow soldering conditions per the product family guidance.
• Reliability and lifetime — Endurance rated for 2000 hours at 105°C; conforms to AEC‑Q200 qualification for applications requiring automotive grade reliability.
• Assembly footprint — Recommended surface mount land size 6.6 × 6.6 mm for straightforward PCB integration.
• Environmental compliance — RoHS compliant.

Typical Applications

• Automotive electronics — Bulk decoupling and smoothing on 10 V power rails in control modules where AEC‑Q200 qualification is required.
• Power supply filtering — Output smoothing and ripple attenuation for DC‑DC converters and point‑of‑load circuits operating at or below 10 V.
• Infotainment and telematics — Local energy storage and transient suppression on compact, high‑density SMD boards.
• High‑density surface‑mount assemblies — Applications that benefit from embossed carrier taping and automated pick‑and‑place handling.

Unique Advantages

• Compact, high‑capacitance SMD form — 220 µF in a φ6.3 × 7.7 mm package conserves board space while providing substantial bulk capacitance.
• Low impedance with defined ripple capability — 340 mΩ impedance and specified ripple currents (140 mA @120 Hz, 280 mA @10 kHz) improve voltage stability on power rails.
• Assembly‑friendly packaging — Embossed carrier taping supports automated placement and efficient manufacturing flow.
• Qualified for demanding environments — AEC‑Q200 qualification and a −55°C to +105°C operating range support deployment in automotive and industrial systems.
• Long endurance at elevated temperature — 2000 hours at 105°C offers predictable aging behavior for designs with higher thermal stress.

Why Choose UWD1A221MCL1GS?

UWD1A221MCL1GS combines a compact SMD chip form factor with low impedance, solid ripple performance, and proven endurance at elevated temperatures, making it well suited for designers needing reliable bulk capacitance on 10 V rails. Its embossed carrier taping and surface‑mount land recommendation simplify integration into automated assembly lines.

With AEC‑Q200 qualification and RoHS compliance, this capacitor is positioned for long‑term use in automotive and industrial designs that demand predictable electrical performance and thermal stability over the product lifecycle.

If you need pricing, lead time, or a formal quote for UWD1A221MCL1GS, please request a quote or contact sales to discuss availability and volume options.