UWD1A560MCL1GS

The UWD1A560MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon's UWD series, designed for surface-mount assembly and compact power filtering. It combines a 56 µF capacitance with a 10 V rating in a small SMD can (φ6.3 × 5.8 mm) optimized for high-density printed circuit boards.

Targeted for automotive applications, this part offers low impedance characteristics, defined ripple current ratings, AEC-Q200 qualification and high-temperature endurance to support demanding operating environments.

Key Features

• Capacitance & Voltage — 56 µF rated capacitance with a 10 V nominal voltage and ±20% tolerance at 20°C, 120 Hz.
• Low Loss / Low Impedance — tanδ (DF) = 0.20 measured at 20°C, 120 Hz and specified impedance of 440 mΩ, delivering stable performance for decoupling and filtering.
• Ripple Current Ratings — Low-frequency ripple current 115 mA at 120 Hz and high-frequency ripple current 230 mA at 10 kHz, specified for application sizing and thermal considerations.
• Leakage Current — Low leakage current of 5.6 µA for minimized standby losses and predictable bias behavior.
• Thermal Endurance — Rated operating range −55°C to +105°C with endurance specified for 2000 hours at 105°C.
• Assembly & Package — Chip-type radial can SMD (φ6.3 × 5.8 mm), surface mountable with embossed carrier taping and compatible with 260°C peak reflow soldering profiles.
• Qualification & Compliance — AEC-Q200 qualified and RoHS compliant, addressing automotive reliability requirements.

Typical Applications

• Automotive Electronics — Used in automotive modules where AEC-Q200 qualification and a −55°C to +105°C operating range are required.
• Power Rail Filtering — Low impedance, specified ripple current and low leakage make the part suitable for smoothing and decoupling on 10 V rails in automotive systems.
• High-Density PCB Assemblies — Compact φ6.3 × 5.8 mm SMD package and embossed carrier taping support automated placement on tightly packed boards and high-temperature reflow processes.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q200 qualification provides documented suitability for automotive system requirements.
• High-Temperature Assembly Compatibility: Designed to withstand 260°C peak reflow, enabling standard lead‑free SMT manufacturing flows.
• Compact, Mountable Package: Small φ6.3 × 5.8 mm chip-style can and embossed carrier taping simplify placement on dense PCBs.
• Predictable Filtering Performance: Defined tanδ, impedance and ripple current specifications allow engineers to size components with confidence.
• Stable Operation Across Temperature: −55°C to +105°C rating and 2000 hours endurance at 105°C support long-term operation in elevated temperature environments.

Why Choose UWD1A560MCL1GS?

UWD1A560MCL1GS positions itself as a compact, automotive-focused SMD electrolytic capacitor that combines low-impedance electrical performance with high-temperature assembly compatibility. Its combination of 56 µF capacitance at 10 V, measured loss characteristics, and defined ripple current ratings make it straightforward to evaluate for power rail filtering and decoupling tasks.

Backed by Nichicon's UWD series engineering, this part is suited for designers seeking a small-footprint, AEC-Q200-qualified electrolytic solution for automotive electronic modules where endurance at elevated temperature and reliable solder reflow compatibility are required.

If you would like pricing, availability or to request a quote for UWD1A560MCL1GS, please contact sales to discuss lead times and order quantities.