UWD1C150MCL1GS

The UWD1C150MCL1GS is a chip-type aluminum electrolytic capacitor in a compact surface-mount can package sized φ4 × 5.8L. It delivers 15 µF capacitance at 16 V with low impedance and polarized construction optimized for high-density PCB assembly.

Engineered for automotive and industrial electronics, this AEC-Q200 qualified component supports automated placement (embossed carrier taping) and withstands high-temperature reflow (260°C peak) while offering long-term performance up to 105°C with a 2000-hour rated life.

Key Features

• Core Performance — 15 µF capacitance with ±20% tolerance and a rated voltage of 16 V; designed for low-impedance operation (specified impedance 1.8 Ω).
• Electrical Characteristics — Low-frequency ripple current 40 mA (120 Hz) and high-frequency ripple current 80 mA (10 kHz); leakage current specified at 3 µA and tan δ measured at 20°C, 120 Hz.
• Thermal & Endurance — Operating temperature range −55°C to +105°C with endurance specified as 2000 hours at 105°C for the φ4 size.
• Assembly & Package — Chip-type, surface-mount radial can (φ4 × 5.8L) supplied in embossed carrier taping for automatic mounting machines; compatible with 260°C peak reflow soldering.
• Reliability & Compliance — AEC-Q200 qualified and RoHS compliant; mass-production status ensures availability for volume designs.

Typical Applications

• Automotive electronic modules — Suited for modules requiring AEC-Q200 qualified, surface-mount capacitors with robust thermal and endurance characteristics.
• High-density PCB assemblies — Chip-type can and embossed carrier taping enable automated placement on compact, tightly routed boards.
• Elevated-temperature environments — Designed for systems that require stable capacitance and controlled leakage up to 105°C with a specified 2000-hour life.

Unique Advantages

• Proven reflow resilience — Specified for 260°C peak reflow (recommended condition), enabling reliable solder processes for modern SMT assembly.
• Automated assembly ready — Embossed carrier taping and chip-type form factor streamline pick-and-place operations for high-volume manufacturing.
• Automotive-grade qualification — AEC-Q200 rating supports use in designs that require recognized component-level automotive reliability.
• Compact, board-friendly footprint — φ4 × 5.8L package with recommended SMD land 4.3 × 4.3 mm helps save PCB space on densely populated boards.
• Measured ripple and leakage specs — Specified ripple currents and low leakage current (3 µA) facilitate predictable behavior in power circuits and filtering applications.

Why Choose UWD1C150MCL1GS?

The UWD1C150MCL1GS combines a compact SMD can package with low impedance, defined ripple handling, and long-term performance at elevated temperatures, making it a solid choice for designs that demand reliable decoupling and energy storage in constrained board space. Its AEC-Q200 qualification and embossed carrier taping make it suitable for automotive and other high-reliability production environments.

Choose this part when you need a verified, production-ready aluminum electrolytic capacitor that supports automated assembly, high-temperature reflow processes, and sustained operation up to 105°C with a defined 2000-hour endurance rating.

If you would like pricing, availability, or a formal quote for UWD1C150MCL1GS, please submit an inquiry or request a quote and our team will respond with details tailored to your requirements.