UWD1C151MCL1GS

The UWD1C151MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount, high-density PCB assemblies. It delivers 150 µF at 16 V in a compact radial can SMD package with low impedance and qualification for automotive use.

Engineered for robust manufacturing and operating environments, this part supports 260°C peak reflow soldering, operates across −55°C to +105°C, and is AEC-Q200 qualified and RoHS compliant.

Key Features

• Electrical Specs — 150 µF capacitance at a rated voltage of 16 V with ±20% tolerance; polarized design suitable for DC filtering and energy buffering.
• Low Impedance Performance — Specified impedance of 340 mOhm, with ripple current ratings of 140 mA at 120 Hz and 280 mA at 10 kHz to support suppression and smoothing in power circuits.
• High-Temperature Operation — Rated operating temperature range from −55°C to +105°C and specified lifetime of 2000 hours at 105°C.
• High-Temperature Reflow Compatibility — Corresponds with 260°C peak reflow soldering; recommended reflow: 260°C peak for 5 seconds and 230°C over 60 seconds (two cycles; for φ10×10 one cycle), enabling compatibility with lead-free, high-temperature assembly flows.
• Automotive Qualification — AEC-Q200 qualified and specified for automotive applications where qualification is required.
• Surface-Mount Package — Radial can SMD package sized L: 7.7 × D: 6.3 mm with recommended land pattern L: 6.6 × W: 6.6 mm; designed for placement on high-density PCBs and compatible with carrier-tape automatic mounting.
• Regulatory Compliance — Compliant with the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — Suitable for automotive modules and circuits where AEC-Q200 qualification and elevated operating temperature are required.
• High-density SMD assemblies — Designed for surface mounting on compact, high-density printed circuit boards.
• Automated production lines — Applicable to automatic mounting machines and carrier-tape feeding for high-volume assembly.
• High-temperature process environments — Built to withstand 260°C peak reflow soldering used in modern lead-free assembly flows.

Unique Advantages

• Compact, high-capacitance SMD form factor — 150 µF in a 7.7 × 6.3 mm package provides bulk capacitance in space-constrained designs.
• Low impedance for effective ripple handling — 340 mOhm impedance plus defined ripple current ratings support stable power-filtering performance across frequency ranges.
• Designed for lead-free, high-temp assembly — Specified reflow profile (260°C peak) reduces assembly risk for high-temperature solder processes.
• AEC-Q200 qualification — Meets automotive component qualification requirements for customers needing validated reliability.
• Durability at elevated temperature — 2000-hour lifetime at 105°C provides predictable long-term behavior in hot environments.
• Manufacturing-ready packaging — Carrier-tape compatible and optimized land pattern simplify pick-and-place and reflow workflows.

Why Choose UWD1C151MCL1GS?

UWD1C151MCL1GS combines a high-capacitance, low-impedance aluminum electrolytic design with explicit support for 260°C reflow and AEC-Q200 qualification, making it suitable for demanding production and operating environments. Its compact SMD radial can package and carrier-tape compatibility simplify integration into high-density, automated assemblies.

This capacitor is well suited to engineers and procurement teams building electronics that require reliable power filtering under elevated temperatures and that must meet automotive qualification and RoHS compliance criteria. The specified electrical and endurance parameters provide clear, verifiable performance for long-term design planning.

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