UWD1C330MCL1GS

The UWD1C330MCL1GS is a chip-type aluminum electrolytic capacitor from the Nichicon UWD series. It provides 33 µF capacitance at 16 V in a compact surface-mount can package designed for high-density PCBs.

Built for demanding assembly and operating environments, this capacitor supports 260°C peak reflow soldering, operates across −55°C to +105°C, and is AEC-Q200 qualified and RoHS compliant—making it suitable for automotive electronic systems and other applications requiring surface-mount, high-temperature reflow compatibility.

Key Features

• Electrical Performance 33 µF capacitance at 16 V with ±20% tolerance and polarization. Impedance specified at 440 mΩ.
• Ripple Current Ratings Ripple current handling of 115 mA at 120 Hz and 230 mA at 10 kHz, enabling decoupling and filtering in switching and power circuits.
• High-Temperature Operation & Endurance Operating temperature range −55°C to +105°C with a rated lifetime of 2000 hours at 105°C.
• 260°C Reflow Compatibility Corresponds with 260°C peak reflow soldering; recommended reflow condition: 260°C peak for 5 seconds and 230°C over 60 seconds (two cycles; see series note for φ10×10 exceptions).
• Surface-Mount Chip Package Radial can SMD package sized L: 5.8 × D: 6.3 mm, with a recommended PCB land of 6.6 × 6.6 mm and seated height up to 5.8 mm.
• Assembly-Ready Designed for automatic mounting machines and carrier-tape feed for high-volume surface-mount assembly.
• Quality & Compliance AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).
• Leakage Current Guideline (Series) Series specification: after 2 minutes at rated voltage and 20°C, leakage current not more than 0.01 CV or 3 µA, whichever is greater.

Typical Applications

• Automotive electronic systems — Surface-mount decoupling and power filtering in modules where AEC‑Q200 qualification and high-temperature reflow compatibility are required.
• High-density PCB power networks — Local energy storage and smoothing on compact boards thanks to the chip package and defined land pattern.
• Volume automated assembly — Designed for carrier-tape feed and automatic pick-and-place assembly in production lines.

Unique Advantages

• 260°C reflow compatibility: Recommended reflow condition (260°C peak for 5 seconds) supports lead-free, high-temperature soldering processes used in modern PCB assembly.
• AEC-Q200 qualification: Series qualification suitable for automotive design workflows where industry-standard component qualification is required.
• Compact SMD can package: 5.8 × 6.3 mm footprint with a 6.6 × 6.6 mm land pattern minimizes PCB area while enabling robust soldered placement.
• Measured low impedance: Specified impedance of 440 mΩ and defined ripple current ratings (115 mA @120 Hz, 230 mA @10 kHz) provide predictable performance in filtering and decoupling roles.
• Wide operating range and endurance: −55°C to +105°C operation with a 2000 hour rating at 105°C for long-term thermal stability in elevated-temperature environments.
• Assembly-ready format: Compatible with carrier-tape automated mounting to streamline high-volume manufacturing.

Why Choose UWD1C330MCL1GS?

The UWD1C330MCL1GS combines series-proven features—260°C reflow compatibility, AEC-Q200 qualification, and RoHS compliance—with a compact chip can package and defined electrical characteristics (33 µF, 16 V, 440 mΩ impedance). It is positioned for designs that require surface-mount capacitors capable of withstanding high-temperature assembly and elevated operating temperatures up to +105°C.

This part is a practical choice for engineers designing automotive electronics and other high-density PCB systems where reliable decoupling, controlled impedance, and automated assembly compatibility are required. Its documented ripple current, temperature endurance, and mounting specifications help simplify BOM selection and layout planning.

To request a quote or submit a purchase inquiry for UWD1C330MCL1GS, please contact our sales team or request pricing and availability through your preferred procurement channel.