UWD1C560MCL1GS

The UWD1C560MCL1GS is a surface-mount, chip-type aluminum electrolytic capacitor from Nichicon’s UWD series. It provides 56 µF capacitance at a 16 V rating with a compact φ6.3 × 5.8 mm can style intended for high-density PCB assemblies.

Designed as a low-impedance, high-temperature SMD capacitor, this part is AEC‑Q200 qualified and rated for operation from −55°C to +105°C, making it suitable for demanding applications that require stable performance, automated placement, and reflow assembly.

Key Features

• Capacitance & Voltage — 56 µF nominal capacitance with a rated voltage of 16 V and tolerance of −20% to +20% (measured at 120 Hz, 20°C).
• Low Impedance Performance — Low impedance construction with an impedance of 440 mΩ and tanδ (DF) of 0.16 measured at 20°C, 120 Hz for reduced loss in filtering and decoupling applications.
• Ripple Current Capability — Specified ripple handling of 115 mA at 120 Hz (low frequency) and 230 mA at 10 kHz (high frequency) for robust smoothing and decoupling under varying load conditions.
• Leakage Current — Low leakage current of 8.96 µA, measured per manufacturer conditions, supporting low-standby-power designs.
• Temperature & Endurance — Rated operating temperature range −55°C to +105°C with endurance of 2000 hours at 105°C.
• SMT Package & Assembly — Chip type radial can for surface mount (φ6.3 × 5.8 mm); supplied in embossed carrier taping compatible with automatic mounting machines and compatible with peak reflow conditions specified by the series.
• Automotive Reliability — AEC‑Q200 qualified per product specifications, suitable for automotive-grade implementations where that qualification is required.

Typical Applications

• Automotive electronics — AEC‑Q200 qualification and −55°C to +105°C operating range support use in automotive modules that require surface-mount electrolytic capacitance.
• High-density PCB assemblies — Chip-type SMD construction and embossed carrier taping enable placement on compact, densely populated PCBs using automatic pick-and-place equipment.
• SMT production lines — Designed for reflow-compatible assembly workflows and suitable for manufacturers requiring components rated for reflow processing and automated handling.

Unique Advantages

• Compact, high-capacity form factor: 56 µF in a φ6.3 × 5.8 mm chip enables substantial capacitance in a small SMD can footprint.
• Measured low-loss characteristics: Specified tanδ of 0.16 and 440 mΩ impedance give predictable AC performance for filtering and decoupling.
• Broad temperature endurance: −55°C to +105°C rating with 2000 h endurance at 105°C supports designs exposed to wide thermal ranges.
• Assembly-ready packaging: Embossed carrier taping and chip-type SMD package streamline automated mounting and throughput on production lines.
• Automotive grade option: AEC‑Q200 qualification provides documented reliability for automotive applications where required.

Why Choose UWD1C560MCL1GS?

The UWD1C560MCL1GS combines compact SMD packaging with measurable low-impedance and stable high-temperature characteristics, making it a practical choice for engineers specifying electrolytic capacitance on space-constrained, high-density PCBs. Its AEC‑Q200 qualification, controlled leakage, and defined ripple-current ratings align the part with applications that demand documented reliability and predictable electrical behavior.

This capacitor is suited for designers and procurement teams seeking a surface-mount electrolytic solution that supports automated assembly, withstands extended high-temperature operation, and integrates into automotive and industrial electronics where AEC‑Q200 qualification and reflow compatibility are required.

If you would like pricing, availability, or a formal quote for UWD1C560MCL1GS, please submit a request or inquiry and a representative will provide lead-time and quotation details.