UWD1C680MCL1GS
| Part Description |
68 µF 16 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,497 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 68 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.1 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 440 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 230 mA @ 10 kHz | Ripple Current Low Frequency | 115 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 16 V |
Overview of UWD1C680MCL1GS – 68 µF, 16 V Low‑Impedance SMD Aluminum Electrolytic Capacitor
The UWD1C680MCL1GS is a chip‑type aluminum electrolytic capacitor designed for surface mount use on high‑density PCBs. It delivers 68 µF at 16 V in a compact φ6.3 × 5.8 mm can with low impedance characteristics and high‑temperature reflow compatibility.
Engineered for demanding environments, this part supports a wide operating range from −55 °C to +105 °C, 2,000‑hour endurance at 105 °C, and AEC‑Q200 qualification, making it well suited for automotive and industrial power filtering and decoupling applications.
Key Features
- Capacitance & Voltage — 68 µF nominal capacitance with a rated voltage of 16 V and ±20% tolerance for bulk decoupling and local energy storage.
- Low Impedance Performance — Specified impedance of 440 mΩ and a tangent of loss angle (tanδ) of 0.16 (measured at 20 °C, 120 Hz) for improved ripple handling and stable AC behavior.
- Ripple Current Ratings — Low‑frequency ripple current 115 mA (120 Hz) and high‑frequency ripple current 230 mA (10 kHz) to support both mains‑frequency and switching converter environments.
- High‑Temperature Reflow Compatible — Chip type designed for 260 °C peak reflow (recommended: 260 °C peak for 5 s; 230 °C for over 60 s) to accommodate modern SMT assembly processes.
- Robust Thermal & Endurance Specs — Operating temperature range −55 °C to +105 °C with a rated lifetime of 2,000 hours at 105 °C (endurance conditions per datasheet).
- Compact SMD Can Package — φ6.3 × 5.8 mm radial can (SMD), surface mount land size 6.6 × 6.6 mm, compatible with automated placement from embossed carrier taping.
- Reliability & Compliance — AEC‑Q200 qualified and RoHS compliant, suitable for applications requiring industry reliability standards.
Typical Applications
- Automotive power electronics — Local decoupling and bulk filtering in control modules and power supplies where AEC‑Q200 qualification and high‑temperature assembly are required.
- DC–DC converters and voltage regulators — Energy storage and ripple suppression for switching converters operating across a broad temperature range.
- Infotainment and telematics — Compact, low‑impedance smoothing capacitors for audio power rails and supply conditioning on dense PCBs.
Unique Advantages
- High‑temperature assembly compatible: Designed for 260 °C peak reflow, enabling reliable placement in modern SMT production flows.
- Low impedance for better ripple performance: 440 mΩ impedance and measured tanδ of 0.16 help reduce voltage ripple and improve power‑rail stability.
- Automotive‑grade reliability: AEC‑Q200 qualification and 2,000 h endurance at 105 °C support long‑term performance in demanding environments.
- Compact footprint: φ6.3 × 5.8 mm SMD can fits high‑density boards while providing 68 µF of capacitance for space‑constrained designs.
- Assembly‑ready packaging: Supplied in embossed carrier taping for automated pick‑and‑place and consistent throughput in production.
- Measured ripple and leakage data: Specified LF/HF ripple currents (115 mA / 230 mA) and leakage current (10.88 µA) allow predictable thermal and bias planning.
Why Choose UWD1C680MCL1GS?
The UWD1C680MCL1GS combines low impedance, compact size, and high‑temperature reflow capability in an AEC‑Q200 qualified aluminum electrolytic SMD package. It addresses the needs of designers who require stable capacitance, controlled loss (tanδ), and predictable ripple handling across −55 °C to +105 °C with proven endurance.
This part is ideal for engineers developing automotive and industrial power systems where board space, reliable SMT assembly, and component longevity are priorities. Its measured electrical characteristics and production‑ready packaging simplify BOM decisions and integration into volume manufacturing.
Request a quote or contact sales to discuss pricing, availability, and lead times for UWD1C680MCL1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016