UWD1E150MCL1GS

The UWD1E150MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount use on high-density PC boards. It combines a 15 µF capacitance with a 25 V rating in a compact radial can SMD package (L: 5.8 × D: 5 mm).

Engineered for assembly environments that require high-temperature reflow, this low-impedance capacitor supports 260°C peak reflow soldering and is AEC-Q200 Qualified and RoHS compliant, making it suitable for demanding automotive and industrial electronics where durability and reliable board-level integration are required.

Key Features

• Capacitance & Voltage — 15 µF nominal capacitance with a 25 V rated voltage and ±20% tolerance at 120 Hz, 20°C.
• High-temperature reflow compatibility — Corresponds with 260°C peak reflow soldering; recommended reflow: 260°C peak for 5 seconds, and 230°C over 60 seconds (2 times; φ10 × 10 : 1 time).
• Wide operating temperature — Rated for operation from −55°C to +105°C, supporting applications that experience elevated ambient temperatures.
• Low impedance — Specified impedance of 760 mΩ, with ripple current ratings of 75 mA at 120 Hz and 150 mA at 100 kHz.
• Durability and lifetime — Endurance rating of 2000 hours at 105°C under specified conditions.
• Surface-mount package — Chip-type radial can SMD package designed for automatic mounting with carrier tape; recommended PCB land size L: 5.3 × W: 5.3 mm.
• Quality and compliance — AEC-Q200 Qualified and RoHS directive compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — Suitable for automotive modules that require AEC-Q200 qualification and components capable of withstanding high-temperature assembly and operation.
• High-density surface-mount PCBs — Designed for compact board layouts where a chip-type aluminum electrolytic capacitor provides bulk filtering or decoupling in a small footprint.
• Assemblies requiring 260°C reflow — Intended for production processes that use 260°C peak reflow soldering profiles.

Unique Advantages

• 260°C reflow-ready: Enables use in modern assembly processes with a recommended 260°C peak reflow profile to simplify manufacturing and reduce process risk.
• AEC-Q200 Qualified: Provides a level of qualification required for many automotive and mission-critical applications, supporting reliability requirements.
• Low impedance and defined ripple capability: 760 mΩ impedance with ripple current specs (75 mA @120 Hz, 150 mA @100 kHz) gives predictable AC performance for filtering and smoothing tasks.
• Compact SMD form factor: 5.8 × 5 mm package with a recommended land size of 5.3 × 5.3 mm enables high-density board designs and automated placement.
• High-temperature operation and endurance: Rated for −55°C to +105°C with a 2000-hour endurance at 105°C for sustained performance in elevated-temperature environments.
• RoHS compliant: Conforms to applicable RoHS directives for regulatory and environmental requirements.

Why Choose UWD1E150MCL1GS?

The UWD1E150MCL1GS positions itself as a robust surface-mount aluminum electrolytic solution for designs that demand high-temperature assembly compatibility, compact board-level integration, and defined electrical performance. With AEC-Q200 qualification and RoHS compliance, it addresses both reliability and regulatory considerations for automotive and industrial electronics.

Its combination of 15 µF capacitance at 25 V, low impedance, specified ripple currents, and a compact radial can SMD package makes it a practical choice for engineers seeking predictable smoothing and decoupling behavior in high-density assemblies that undergo 260°C peak reflow and operate up to +105°C.

Request a quote or contact sales to discuss availability, lead times, and pricing for the UWD1E150MCL1GS.