UWD1E270MCL1GS

The UWD1E270MCL1GS is a chip‑type aluminum electrolytic capacitor designed for surface mounting on high‑density PC boards. It combines low impedance electrical performance with high‑temperature reflow compatibility and AEC‑Q200 qualification for demanding electronic assemblies.

Targeted at applications that require reliable decoupling and energy buffering in elevated temperature environments, this part offers a compact SMD can package and assembly compatibility for automated, tape‑fed production lines.

Key Features

• Electrical Performance Capacitance 27 µF at a rated voltage of 25 V with ±20% tolerance and a low impedance of 440 mΩ for stable decoupling and smoothing.
• Ripple Current Capability Rated ripple current of 115 mA at 120 Hz and 230 mA at 10 kHz to support both low‑ and high‑frequency power filtering needs.
• Temperature & Reliability Operates from −55 °C to +105 °C with a specified lifetime of 2000 hours at 105 °C, and AEC‑Q200 qualification for use in reliability‑sensitive designs.
• High‑Temperature Reflow Compatibility Designed for 260 °C peak reflow soldering (recommended: 260 °C peak 5 s; 230 °C over 60 s, 2 times for most sizes) to support modern lead‑free assembly processes.
• Surface Mount Package Chip/can SMD package sized L: 5.8 × D: 6.3 mm with a recommended land pattern of 6.6 × 6.6 mm for high‑density PCB layouts.
• Assembly Ready Applicable to automatic mounting machines and carrier tape feed for efficient, high‑volume production.
• Compliance RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronic modules Useful in automotive control and power modules where AEC‑Q200 qualification and operation up to +105 °C are required.
• High‑density PCB power rails Compact chip package and low impedance make it suitable for localized decoupling on densely populated boards in automotive and industrial systems.
• Automotive sensor and ECU assemblies Tape‑feed compatibility and high‑temperature reflow capability simplify automated assembly of sensor interfaces and electronic control units.

Unique Advantages

• AEC‑Q200 Qualification: Provides a level of component qualification useful for designs that require established automotive reliability standards.
• High‑temperature reflow capability: Rated for 260 °C peak reflow, enabling compatibility with lead‑free, high‑temperature assembly processes without compromising performance.
• Compact SMD can: Small L: 5.8 × D: 6.3 mm footprint and tape‑feed compatibility support high‑density boards and automated placement.
• Defined ripple handling: Specified ripple currents at both 120 Hz and 10 kHz give clear guidance for power‑filter design across frequency ranges.
• Long life at elevated temperature: Specified 2000 hours at 105 °C provides predictable endurance for thermal stress environments.
• RoHS compliance: Meets environmental directives relevant to modern electronics manufacturing.

Why Choose UWD1E270MCL1GS?

UWD1E270MCL1GS is positioned for designs that demand a compact, surface‑mount aluminum electrolytic capacitor with verified high‑temperature assembly compatibility and automotive‑grade qualification. Its combination of low impedance, specified ripple current performance, and a lifecycle rating at 105 °C make it suitable for engineers balancing performance, reliability, and manufacturability.

This part is ideal for development teams and procurement focused on robust, automated production of high‑density boards in automotive and related markets, offering predictable electrical and thermal behavior along with RoHS compliance.

Request a quote or contact sales to discuss availability, lead times, and how UWD1E270MCL1GS can fit your next high‑reliability design.