UWD1E151MCL1GS

The UWD1E151MCL1GS is a chip-type aluminum electrolytic capacitor optimized for surface-mount assemblies and high-temperature reflow processes. It delivers 150 µF at 25 V with low impedance and is designed for high-density PCB mounting and automated assembly.

Built for demanding environments, this part supports 260°C peak reflow soldering, operates across −55°C to +105°C, and carries AEC-Q200 qualification and RoHS compliance, making it suitable for automotive and other high-reliability applications.

Key Features

• Capacitance & Voltage — 150 µF rated capacitance at 25 V; polarization is polarized with ±20% tolerance.
• Low Impedance — Specified impedance of 170 mΩ, supporting stable power filtering and decoupling in compact designs.
• High-Temperature Reflow — Chip-type construction compatible with 260°C peak reflow (recommended: 260°C peak for 5 s; 230°C over 60 s), suitable for modern lead-free assembly flows.
• Extended Temperature & Lifetime — Operating range from −55°C to +105°C with endurance rated at 5000 hours at 105°C.
• Ripple Current Capability — 225 mA at 120 Hz and 450 mA at 10 kHz, addressing both low- and high-frequency ripple conditions.
• Surface-Mount Package — Radial can SMD chip type sized L: 1 × D: 0.8 cm with recommended land pattern 8.3 × 8.3 mm; compatible with carrier-tape fed automated placement.
• Quality & Compliance — AEC-Q200 qualification and RoHS (2011/65/EU, (EU)2015/863) compliance for regulated and automotive markets.

Typical Applications

• Automotive Electronics — Designed and qualified for use in automotive systems where AEC-Q200 compliance and high-temperature operation are required.
• High-Density Surface-Mount Assemblies — Chip-type SMD form factor and compact footprint enable power smoothing and decoupling on space-constrained PCBs.
• Automated Manufacturing — Compatible with carrier-tape mounting and high-temperature reflow processes for efficient automated placement and soldering.

Unique Advantages

• Reflow-Ready for Lead-Free Processes: Specified for 260°C peak reflow to align with modern lead-free assembly requirements, reducing process constraints.
• Long-Term High-Temperature Reliability: Rated 5000 hours at 105°C, enabling predictable performance in elevated-temperature environments.
• Low-Impedance Performance: 170 mΩ impedance supports effective filtering and transient handling in compact power stages.
• Automotive-Grade Qualification: AEC-Q200 qualification provides a verified reliability baseline for automotive system integration.
• Assembly-Friendly Package: Chip-type can and carrier-tape compatibility simplify pick-and-place integration on high-density boards.
• Regulatory Compliance: RoHS-compliant construction supports deployment in regulated markets without additional material constraints.

Why Choose UWD1E151MCL1GS?

UWD1E151MCL1GS combines low impedance, compact SMD packaging, and high-temperature reflow capability with AEC-Q200 qualification, delivering a rugged capacitor solution for designs that require reliable decoupling and filtering under automotive-grade conditions. Its 150 µF/25 V rating, specified ripple currents, and 5000-hour endurance at 105°C provide measurable performance and longevity for demanding applications.

This part is well suited for engineers specifying components for automotive electronics and other high-reliability, high-temperature assembly environments who need a compact, assembly-friendly electrolytic capacitor with documented endurance and compliance.

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