UWD1E330MCL1GS

The UWD1E330MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly on high-density PCBs. It delivers 33 µF capacitance at a 25 V rating in a compact φ6.3 × 5.8 mm SMD can, optimized for automated carrier-tape mounting and reflow processes.

Engineered with low impedance characteristics, AEC-Q200 qualification and operation across −55 °C to +105 °C, this part targets automotive and other demanding applications that require robust filtering, decoupling, and durable performance under elevated temperature and vibration-prone environments.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with ±20% tolerance and a rated voltage of 25 V for bulk filtering and decoupling.
• Low Impedance Performance — Specified impedance of 440 mΩ and tanδ 0.14 (measured at 20 °C, 120 Hz) for efficient ripple attenuation and stable AC behavior.
• Ripple Current & Leakage — Low-frequency ripple current 115 mA (120 Hz), high-frequency ripple current 230 mA (10 kHz), and leakage current 8.25 µA to support power-conditioning tasks.
• High-Temperature Endurance — Rated for operation from −55 °C to +105 °C with an endurance specification of 2000 hours at 105 °C.
• High-Temperature Reflow Compatibility — Chip-type construction compatible with 260 °C peak reflow processes, suitable for modern SMT assembly flows.
• Automotive-Grade Reliability — AEC-Q200 qualified and RoHS compliant for use in regulated environments and automotive-grade designs.
• Compact SMD Package & Assembly Friendly — Radial SMD can (φ6.3 × 5.8 mm) with embossed carrier taping for automatic mounting; recommended land size 6.6 × 6.6 mm.

Typical Applications

• Automotive Electronics — Filtering and decoupling in control modules and electronic units where AEC-Q200 qualification and temperature endurance are required.
• Compact Power Supply Filtering — Bulk and output filtering in space-constrained DC–DC converters and power modules on high-density PCBs.
• Automated SMT Production — Designed for carrier-tape feeding and compatibility with high-temperature reflow processes used in modern assembly lines.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q200 qualification provides documented suitability for automotive electronic systems and related reliability expectations.
• Reflow-Ready Construction: Chip-type design verified for 260 °C peak reflow enables integration into lead-free SMT manufacturing flows without additional handling constraints.
• Space-Efficient Footprint: φ6.3 × 5.8 mm SMD can balances capacitance with a compact package for high-density board layouts.
• Measured Low Impedance: 440 mΩ impedance and controlled tanδ support effective ripple suppression and stable AC performance in power circuits.
• Designed for Automated Assembly: Embossed carrier taping and recommended land pattern simplify pick-and-place and soldering processes.
• High-Temperature Endurance: Specified 2000 hours at 105 °C for longevity in elevated-temperature environments common to automotive and industrial applications.

Why Choose UWD1E330MCL1GS?

UWD1E330MCL1GS combines a compact SMD aluminum electrolytic design with low-impedance performance and high-temperature reflow compatibility, making it a practical choice for engineers designing robust power filtering and decoupling into space-constrained assemblies. Its AEC-Q200 qualification and 2000-hour endurance at 105 °C align the part to the reliability demands of automotive and harsh-environment electronics.

Specified ripple currents, low leakage, and measured impedance/tanδ values provide clear performance metrics to support component selection and system-level power budgeting. The embossed carrier taping and recommended land pattern ease integration into automated SMT production and high-density PCB layouts.

Request a quote or submit an inquiry to our sales team to discuss availability, lead times, and how UWD1E330MCL1GS can fit into your next design.