UWD1E560MCL1GS

The UWD1E560MCL1GS is a chip‑type aluminum electrolytic capacitor designed for surface mounting on high‑density PCBs. It combines a low‑impedance construction with high‑temperature reflow capability and is targeted at applications requiring robust performance up to +105°C.

Built for automated assembly and AEC‑Q200 qualification, this part is suitable for demanding electronics in automotive and industrial segments where high reflow temperature compatibility and long endurance at elevated temperature are required.

Key Features

• Capacitance & Voltage — 56 µF rated capacitance at 25 V.
• Low Impedance Performance — Impedance specified at 440 mOhm, with ripple current ratings of 115 mA (120 Hz) and 230 mA (10 kHz).
• High‑Temperature Operation — Rated for operation from −55°C to +105°C with endurance specified at 2000 hours at 105°C.
• 260°C Reflow Compatibility — Chip type designed for peak reflow soldering up to 260°C; recommended reflow condition: 260°C peak for 5 seconds (with 230°C over 60 seconds as an alternate profile per datasheet guidance).
• Surface Mount Package — Radial can SMD (chip type) sized L: 5.8 × D: 6.3 mm with recommended land size 6.6 × 6.6 mm for PCB layout.
• Reliability & Endurance — AEC‑Q200 Qualified and specified endurance (restored to 20°C after rated voltage applied for 5000 hours; 2000 hours for small diameters), with leakage and tan δ limits defined by the series specifications.
• Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).
• Polarized — Polarized capacitor construction for DC circuits.

Typical Applications

• Automotive electronics — Designed for use in automotive electronic modules where AEC‑Q200 qualification and high‑temperature endurance are required.
• High‑density PCB assemblies — Chip‑type SMD can for compact power filtering and decoupling on space‑constrained boards.
• Automated assembly lines — Compatible with automatic mounting machines fed with carrier tape and reflow soldering processes up to 260°C.

Unique Advantages

• Reflow‑ready at elevated temperatures — Specified for 260°C peak reflow, enabling use with high‑temperature soldering profiles and lead‑free assembly.
• High operating temperature and endurance — Rated to +105°C with endurance ratings (2000 hours at 105°C for this size) for extended reliability in hot environments.
• Automotive‑grade qualification — AEC‑Q200 qualification supports use in automotive designs requiring industry reliability validation.
• Low impedance with defined ripple capability — 440 mOhm impedance and explicit ripple current ratings at 120 Hz and 10 kHz to support power smoothing and decoupling tasks.
• SMD form factor for compact designs — Small radial can package and recommended PCB land pattern simplify integration on high‑density boards.
• RoHS compliant — Meets current RoHS directive requirements for restricted substances.

Why Choose UWD1E560MCL1GS?

UWD1E560MCL1GS delivers a combination of low impedance, high‑temperature endurance and assembly compatibility suited to demanding electronics environments. Its chip SMD form, AEC‑Q200 qualification, and defined ripple and endurance specifications make it a pragmatic choice for designers needing a reliable aluminum electrolytic solution for compact power and decoupling applications.

This part is well suited to engineers developing automotive or industrial systems that require verified high‑temperature reflow compatibility, clear performance specifications (impedance, ripple, lifetime) and compliance with RoHS directives.

Request a quote or contact sales to discuss availability, lead times and volume pricing for UWD1E560MCL1GS.