UWD1H100MCL1GS

The UWD1H100MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mount assembly. It delivers 10 µF capacitance at a 50 V rating in a compact radial can SMD package intended for high‑density PCB layouts.

Engineered for robust thermal and process compatibility, this capacitor supports high‑temperature reflow (260°C peak) and is qualified to AEC‑Q200 with RoHS compliance, making it suitable for demanding electronics applications that require reliable filtering and decoupling under elevated temperature conditions.

Key Features

• Electrical Performance — 10 µF capacitance at 50 V with polarization and a tolerance of -20% to +20%; low impedance specified at 880 mΩ to support effective smoothing and decoupling.
• Ripple Current Ratings — Specified ripple current of 82.5 mA at 120 Hz and 165 mA at 10 kHz to characterize AC stress capability across common power frequencies.
• Thermal Range & Endurance — Operating temperature range from -55°C to +105°C with a rated lifetime of 2000 hours at 105°C.
• High‑Temperature Reflow Compatibility — Designed for 260°C peak reflow soldering; recommended reflow condition: 260°C peak for 5 seconds, and 230°C over 60 seconds (two cycles; φ10 × 10: 1 cycle as noted).
• Packaging & Mounting — Chip type radial can SMD package sized L: 5.8 × D: 6.3 mm with a surface mount land size of 6.6 × 6.6 mm; compatible with automatic mounting machines fed with carrier tape.
• Standards & Compliance — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting use in regulated environments and qualifying processes.

Typical Applications

• Automotive electronics — Suited for modules and assemblies that require AEC‑Q200 qualification and operation up to +105°C.
• High‑density PCB assemblies — Designed for surface mounting on compact boards and compatible with automated carrier‑tape pick‑and‑place processes.
• Power supply filtering and decoupling — 10 µF / 50 V with low impedance and defined ripple current ratings for smoothing and decoupling in power circuits.

Unique Advantages

• High‑temperature process compatibility: Rated for 260°C peak reflow to match modern assembly profiles and reduce process risk for high‑temperature soldering.
• AEC‑Q200 qualification: Provides assurance for use in regulated and high‑reliability applications where qualification is required.
• Compact SMD radial can: Small footprint (5.8 × 6.3 mm) and defined land pattern (6.6 × 6.6 mm) ease integration into high‑density layouts.
• Measured ripple performance: Explicit ripple current specs at 120 Hz and 10 kHz allow predictable AC performance in power circuits.
• Durability at elevated temperature: Rated lifetime of 2000 hours at 105°C supports long‑term operation in warm operating environments.
• RoHS compliance: Meets RoHS directive (2011/65/EU, (EU)2015/863) requirements for regulated material content.

Why Choose UWD1H100MCL1GS?

UWD1H100MCL1GS combines a compact chip‑type SMD package with low impedance electrical performance and explicit high‑temperature reflow compatibility, making it a practical choice for engineers balancing assembly process demands with thermal and reliability requirements. Its AEC‑Q200 qualification and rated endurance at +105°C position it for demanding applications that require traceable qualification and defined long‑term performance.

This part is ideal for designs that require a proven, surface‑mount aluminum electrolytic with clear ripple current and lifetime specifications—especially where automated placement, high‑temperature reflow, and regulated compliance are part of the production and qualification workflow.

If you would like pricing, availability, or a formal quote for UWD1H100MCL1GS, please request a quote or submit an inquiry to our sales team and include your required quantities and delivery timeline.