UWD1H150MCL1GS

The UWD1H150MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon's UWD series, engineered for surface-mount assembly on high-density PC boards. It combines low impedance electrical performance with high-temperature reflow compatibility and automotive‑grade qualification.

Key use cases include compact power filtering and decoupling in electronics exposed to elevated temperatures and automated assembly lines. The part delivers measurable ripple handling, a compact φ6.3 × 5.8 mm package, and AEC‑Q200 qualification for automotive applications.

Key Features

• Capacitance and Voltage — 15 µF nominal capacitance with ±20% tolerance at 20°C, rated for 50 V operation.
• Low Impedance Performance — Specified impedance of 880 mΩ and defined ripple current capability (82.5 mA at 120 Hz, 165 mA at 10 kHz) for improved smoothing and decoupling.
• Leakage and Endurance — Low leakage current specified at 7.5 µA and endurance rated to 2000 hours at 105°C, providing predictable behavior over life.
• High‑Temperature Reflow Compatibility — Designed for 260°C peak reflow soldering (recommended: 260°C peak for 5 s; 230°C over 60 s). Suitable for reflow processes used in automated SMD assembly.
• Robust Operating Range — Wide operating temperature range from −55°C to +105°C to cover thermal stress in demanding environments.
• Surface Mount Package & Assembly — Chip-type radial can SMD (φ6.3 × 5.8 mm) optimized for automatic placement; embossed carrier taping for high-volume production and a recommended land size of 6.6 × 6.6 mm.
• Qualification & Compliance — AEC‑Q200 qualified and RoHS compliant, supporting automotive and regulated production requirements.

Typical Applications

• Automotive control modules — AEC‑Q200 qualification and 105°C endurance make the part suitable for power filtering and decoupling in vehicle electronic control units.
• High-density SMD assemblies — Chip-type construction and embossed carrier taping enable reliable placement on compact, densely populated PCBs.
• Power supply filtering — Low impedance and defined ripple current ratings support smoothing and transient suppression in DC‑DC converters and onboard regulators.
• Automated, high-volume production — Compatibility with 260°C reflow profiles and packaging for automatic mounting streamline assembly and test flows.

Unique Advantages

• Measurable ripple handling: Specified low-frequency and high-frequency ripple current ratings provide clear guidance for power-design margins.
• High‑temperature process compatibility: Recommended 260°C peak reflow capability aligns with modern soldering processes used in automated manufacturing.
• AEC‑Q200 qualification: Explicit qualification supports use in automotive designs where component-level reliability data is required.
• Compact SMD form factor: φ6.3 × 5.8 mm chip package and defined land pattern reduce board area while preserving capacitance density.
• Predictable lifetime: 2000 hours at 105°C endurance rating helps designers size margins for long-term operation under elevated temperatures.

Why Choose UWD1H150MCL1GS?

UWD1H150MCL1GS offers a balanced combination of low impedance, defined ripple capability, and high-temperature reflow compatibility in a compact SMD aluminum electrolytic package. Its AEC‑Q200 qualification and 2000‑hour endurance at 105°C make it a practical choice for engineers designing robust electronics for automotive and other temperature‑stress environments.

This part is well suited to teams requiring predictable electrical performance and automated assembly compatibility—providing a compact, RoHS‑compliant solution from a recognized manufacturer for production-scale designs.

Request a quote or contact our sales team to discuss availability, lead times, pricing, and sample options for UWD1H150MCL1GS.