UWD1E680MCL1GS

The UWD1E680MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount assemblies. It provides 68 µF capacitance at 25 V in a compact φ6.3 × 5.8 mm package with low impedance and support for high-temperature reflow.

Targeted at demanding electronic modules, this part offers a combination of AEC-Q200 qualification, broad operating range (−55°C to +105°C), and manufacturing-ready packaging (embossed carrier taping) for automated placement.

Key Features

• Capacitance & Voltage — 68 µF nominal capacitance with ±20% tolerance at 25 V rated voltage, suitable for bulk and decoupling roles within the rated voltage.
• Low Impedance — Rated impedance of 440 mΩ to support effective filtering and energy smoothing in compact power circuits.
• Ripple Performance — Low-frequency ripple current 115 mA (120 Hz) and high-frequency ripple current 230 mA (10 kHz) for handling dynamic load conditions.
• Thermal & Endurance — Operating temperature range −55°C to +105°C with endurance specified at 2000 hours at 105°C for long-term thermal stability.
• High-Temperature Reflow Compatibility — Engineered to withstand 260°C peak reflow conditions for reliable assembly on modern SMT lines.
• Package & Mounting — Chip-type, surface-mount radial can (φ6.3×5.8 mm) supplied in embossed carrier taping for automatic placement on high-density PCBs.
• Quality & Compliance — AEC-Q200 rated and RoHS compliant, aligning with industry requirements for regulated applications.
• Leakage — Low leakage current specified at 17 µA, supporting low-standby current designs.

Typical Applications

• Automotive electronics — Suited for vehicle electronic modules where AEC-Q200 qualification, operation to +105°C, and endurance at elevated temperature are required.
• Power management modules — Used for local energy storage and smoothing in DC–DC converters and power-supply rails within the 25 V rating, leveraging its low impedance and ripple current capability.
• High-density SMD assemblies — Chip form factor and embossed carrier taping make it appropriate for automated placement on compact, high-component-count PCBs.

Unique Advantages

• Reflow-friendly assembly: Supports 260°C peak reflow, enabling compatibility with modern SMT processes and reducing assembly risk.
• Automotive-grade reliability: AEC-Q200 rating and 2000-hour endurance at 105°C provide traceable reliability for regulated and rugged applications.
• Compact, board-friendly footprint: φ6.3×5.8 mm chip can in embossed tape for automatic mounting, saving board space while maintaining performance.
• Robust ripple handling: Specified ripple currents at both low and high frequencies mitigate voltage ripple under dynamic loads.
• Low leakage: 17 µA leakage current supports low-power states and minimizes parasitic losses in sensitive circuits.
• Regulatory compliance: RoHS compliance supports deployment in environments requiring restricted-substance adherence.

Why Choose UWD1E680MCL1GS?

The UWD1E680MCL1GS balances compact SMD packaging with performance-oriented electrical characteristics—68 µF at 25 V, low impedance (440 mΩ), and specified ripple currents—making it well suited for power filtering and energy storage in tightly packed electronic assemblies. Its AEC-Q200 rating, extended temperature range, and 2000-hour endurance at 105°C position it for use in demanding environments that require long-term thermal stability.

Designed for automated production, the embossed carrier taping and 260°C reflow compatibility simplify integration into high-volume SMT workflows, while RoHS compliance and defined leakage performance help streamline qualification for regulated designs.

If you would like pricing, lead-time, or a formal quote for UWD1E680MCL1GS, please request a quote or contact sales with your quantity and delivery requirements.