UWD1E471MCL1GS

The UWD1E471MCL1GS is a chip-type aluminum electrolytic capacitor engineered for surface-mount, high-density PCB assemblies. It delivers 470 µF capacitance at 25 V in a compact φ10 × 10 mm can, combining low impedance and long endurance for demanding thermal and electrical environments.

Designed for automated assembly and high-temperature reflow soldering, this part targets applications that require robust smoothing, decoupling and energy storage where reliability, high ripple tolerance and AEC-Q200 qualification are required.

Key Features

• Capacitance & Voltage — 470 µF nominal capacitance with ±20% tolerance, rated for 25 V operation.
• Low Impedance — Typical impedance of 90 mΩ supports low-loss performance in power and decoupling applications.
• High Ripple Capability — Low-frequency ripple current 335 mA (120 Hz) and high-frequency ripple current 670 mA (10 kHz), enabling reliable AC ripple handling across frequencies.
• High-Temperature Endurance — Rated operating temperature −55 °C to +105 °C with 5000 hours endurance at 105 °C.
• High-Temperature Reflow Compatible — Supports 260 °C peak reflow (recommended: 260 °C peak for 5 s; 230 °C over 60 s; up to 2 cycles with part-specific allowances), enabling modern assembly processes.
• Reliability & Qualification — AEC-Q200 qualified and RoHS compliant for regulated environments and automotive-grade design flows.
• Compact Surface-Mount Package — Chip-type radial can for SMD mounting, size φ10 × 10 mm with embossed carrier taping for automatic mounting machines.
• Electrical Loss — Tangent of loss angle (tan δ) 0.16 measured at 20 °C, 120 Hz, for predictable AC loss characteristics.

Typical Applications

• Automotive electronics — Use in on-board modules and control units requiring AEC-Q200 qualification and robust operation across −55 °C to +105 °C.
• Surface-mount high-density PCBs — Designed for chip-type mounting on compact boards where board space and automated placement are priorities.
• Automated assembly lines — Supplied in embossed carrier tape format and compatible with automatic mounting machines for high-volume production.

Unique Advantages

• High ripple tolerance: Specified ripple currents at 120 Hz and 10 kHz enable dependable filtering and smoothing across a range of switching frequencies.
• Long life at high temperature: 5000 hours endurance at 105 °C supports longevity in thermally stressed applications.
• Reflow-ready for modern manufacturing: Verified for 260 °C peak reflow conditions to integrate with lead-free assembly processes.
• AEC-Q200 qualified: Qualification for automotive-grade requirements reduces qualification burden for vehicle electronics designs.
• Compact SMD form factor: φ10 × 10 mm chip can and embossed tape packaging simplify placement in space-constrained designs and automated lines.
• Predictable electrical behavior: Low impedance (90 mΩ) and specified tan δ under measurement conditions provide clear design parameters for power delivery networks.

Why Choose UWD1E471MCL1GS?

The UWD1E471MCL1GS positions itself as a reliable, assembly-friendly aluminum electrolytic solution for engineers needing high capacitance in a compact surface-mount package. With AEC-Q200 qualification, RoHS compliance, and verified high-temperature reflow capability, it addresses durability and manufacturability requirements for professional electronic and automotive designs.

This part is well suited for designs that demand a balance of capacitance density, low impedance, ripple handling, and long-term thermal endurance—reducing rework risk in automated production and supporting stable power performance across operating conditions.

Request a quote or submit an inquiry to receive pricing, lead-time information, or assistance selecting UWD1E471MCL1GS for your design and production requirements.