UWD1E331MCL1GS

The UWD1E331MCL1GS is a chip‑type aluminum electrolytic capacitor engineered for surface‑mount assembly on high‑density printed circuit boards. It delivers 330 µF capacitance at 25 V with a low impedance construction and is designed for automated mounting and high‑temperature reflow processing.

Targeted for automotive electronics, this AEC‑Q200 qualified, RoHS‑compliant capacitor combines a compact SMD can package with long endurance at elevated temperatures, offering predictable electrical performance for demanding environments.

Key Features

• Capacitance & Voltage — 330 µF rated capacitance at 25 V suitable for bulk capacitance and energy storage in compact designs.
• Low Impedance — 90 mOhm impedance specified, supporting effective filtering and transient handling when paired with system requirements.
• Ripple Current Capability — Rated ripple currents of 335 mA at 120 Hz and 670 mA at 10 kHz to support AC ripple and switching‑power conditions.
• High‑Temperature Operation — Operating temperature range from −55 °C to +105 °C with endurance specified at 5000 hours at 105 °C.
• High‑Temperature Reflow Compatible — Corresponds with 260 °C peak reflow soldering (recommended: 260 °C peak for 5 s; 230 °C over 60 s), enabling compatibility with high‑temperature assembly processes.
• Automated Surface Mount Ready — Chip type designed for surface mounting on high‑density PCBs and compatible with automatic mounting machines fed with carrier tape.
• Quality & Compliance — AEC‑Q200 Qualified and RoHS compliant (2011/65/EU, (EU)2015/863).
• Compact SMD Can Package — Radial, can‑style SMD package with footprint sizing: 1.00 cm × 1.00 cm (land size 1.03 cm × 1.03 cm) for space‑constrained layouts.

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and a −55 °C to +105 °C temperature range make this capacitor suitable for use in automotive electronic modules that require reliable SMD capacitors.
• Power Supply Filtering — 330 µF capacitance, 90 mOhm impedance and specified ripple current ratings support filtering and smoothing in DC power rails and converters.
• High‑Density PCB Assemblies — Designed for surface mounting and automated placement, the compact can‑style package fits densely populated boards and automated production flows.

Unique Advantages

• Designed for High‑Temp Reflow: Compatibility with 260 °C peak reflow allows this capacitor to be soldered in high‑temperature assembly processes without compromising specified characteristics.
• High Endurance at Elevated Temperatures: 5000 hours endurance at 105 °C provides long‑term electrical stability for designs exposed to sustained heat.
• Automotive‑Grade Qualification: AEC‑Q200 qualification supports deployment in applications that require recognized component reliability standards.
• Compact SMD Can Footprint: The 1.00 cm × 1.00 cm package and tape‑feed compatibility simplify integration into automated manufacturing and space‑limited boards.
• Measured Ripple Performance: Explicit ripple current ratings at 120 Hz and 10 kHz enable designers to size capacitors against expected AC stress and switching frequencies.
• Regulatory Compliance: RoHS compliance aligns with common environmental and manufacturing requirements.

Why Choose UWD1E331MCL1GS?

The UWD1E331MCL1GS positions itself as a rugged, assembly‑friendly SMD electrolytic capacitor that balances high capacitance with low impedance and measurable ripple performance. Its compact radial can package, compatibility with automated placement, and 260 °C reflow tolerance make it practical for high‑density board designs.

With AEC‑Q200 qualification, a broad operating temperature range, and long endurance at 105 °C, this part is suited for engineers designing automotive and other high‑reliability electronic systems where proven electrical behavior and manufacturing compatibility are priorities.

If you would like a quote or need additional technical detail about UWD1E331MCL1GS for your design, please request a quotation or contact sales to discuss availability and lead times.