UWD1H010MCL1GS

The UWD1H010MCL1GS from Nichicon is a chip-type aluminum electrolytic capacitor in the UWD series, engineered for surface-mount assemblies and automatic tape-fed placement. It provides 1 µF capacitance at a 50 V rating in a compact radial can SMD package (L: 5.8 × D: 4 mm).

Designed for applications that require high-temperature reflow compatibility and extended operating range, the part supports 260°C peak reflow processes, operates from −55°C to +105°C, and is AEC-Q200 qualified and RoHS compliant—making it suitable for automotive and other demanding environments where component-level reliability and high-density mounting are required.

Key Features

• Capacitance & Voltage — 1 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance (120 Hz, 20°C).
• Low Impedance Performance — Designed as a low-impedance chip-type aluminum electrolytic; specified impedance value of 5 Ω for this part.
• High-Temperature Reflow Compatibility — Corresponds with 260°C peak reflow soldering. Recommended reflow condition: 260°C peak for 5 seconds; 230°C over 60 seconds (two cycles, with specific exceptions for larger diameters).
• Wide Operating Temperature & Endurance — Rated for −55°C to +105°C operation with a lifetime specification of 2000 hours at 105°C for this part size.
• Reliability & Standards — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863); leakage current specification: after 2 minutes at rated voltage and 20°C, leakage ≤ 0.01CV or 3 µA, whichever is greater.
• Ripple Current Capability — Specified ripple current: 15 mA at 120 Hz and 30 mA at 10 kHz for this part.
• Surface-Mount Packaging — Radial can SMD intended for high-density PCBs; suitable for automatic mounting machines fed with carrier tape. Recommended PCB land size: 4.3 × 4.3 mm.

Typical Applications

• Automotive electronic modules — AEC-Q200 qualification and +105°C operation support use in automotive control and instrumentation modules where surface-mount packaging is required.
• High-density PCB assemblies — Compact chip can and tape-feed compatibility make this part suitable for densely populated boards requiring automated placement.
• Boards requiring high-temperature reflow — Designed to withstand 260°C peak reflow profiles used in modern lead-free assembly processes.
• Power and filtering circuits in elevated-temperature environments — Low impedance and specified ripple current support smoothing and decoupling functions where thermal endurance is necessary.

Unique Advantages

• 260°C reflow-rated: Enables use in lead-free, high-temperature assembly flows without special handling.
• AEC-Q200 qualified: Provides an established reliability baseline for automotive-oriented designs.
• Compact SMD can: 5.8 × 4 mm footprint and tape-feed compatibility reduce board area and simplify automated placement for high-volume production.
• Measured low impedance and ripple capability: Supports stable power delivery in compact designs with defined ripple current ratings at 120 Hz and 10 kHz.
• Endurance at elevated temperature: 2000 hours at 105°C offers predictable performance for thermal stress applications.
• RoHS compliant: Meets current environmental substance directives for global assembly requirements.

Why Choose UWD1H010MCL1GS?

UWD1H010MCL1GS is positioned for surface-mount applications that combine compact packaging, high-temperature assembly compatibility, and defined reliability credentials. With AEC-Q200 qualification, RoHS compliance, and a rated operating range to +105°C, it addresses designs that demand both automated assembly and thermal endurance.

This part is ideal for engineers specifying capacitors for automotive modules, high-density consumer or industrial PCBs, and any design that must tolerate 260°C peak reflow while maintaining low-impedance performance and predictable leakage/ripple behavior over time.

For pricing, lead times, or to request a quote, please contact sales or submit a quote request specifying UWD1H010MCL1GS and your required quantities and delivery timeline.