UWD1H151MCL1GS

The UWD1H151MCL1GS is a surface-mount aluminum electrolytic chip capacitor in Nichicon’s UWD series, engineered for high-temperature reflow and long-term operation. It delivers 150 µF capacitance at a 50 V rating with low impedance and specified ripple performance, making it suitable for demanding electronics assemblies that require compact SMD power filtering and decoupling.

Designed with AEC-Q200 qualification and RoHS compliance, this part targets applications that demand automotive-grade reliability, automated placement, and thermal resilience up to 105°C with 260°C peak reflow compatibility.

Key Features

• Capacitance and Tolerance — 150 µF nominal capacitance with tolerance of -20% to +20% (±20% at 120 Hz, 20°C as specified).
• Rated Voltage — 50 V working voltage for mid-voltage power systems.
• Low Impedance Performance — Impedance of 180 mΩ and a tangent of loss angle (tan δ) of 0.14 (measured at 20°C, 120 Hz, 50 V) for efficient AC performance.
• Ripple Current Capability — Rated for 335 mA at 120 Hz (low frequency) and 670 mA at 10 kHz (high frequency) to support smoothing and decoupling under dynamic loads.
• Leakage Current — Specified leakage current of 75 µA, suitable for power-sensitive circuits.
• High-Temperature Endurance — Qualified for 5000 hours at 105°C to support long operational life in elevated-temperature environments.
• Package and Assembly — Chip-type, radial can SMD in φ10×10L size (approx. 10 mm × 10 mm) with embossed carrier taping for automated pick-and-place processing.
• Reflow Compatibility — Designed for high-temperature reflow with 260°C peak reflow capability as specified in the UWD series documentation.
• Standards & Compliance — AEC-Q200 qualified and RoHS compliant for regulated environments and automotive-grade applications.

Typical Applications

• Automotive electronic systems — AEC-Q200 qualification and 105°C endurance make this capacitor suitable for automotive control modules where board-level bulk capacitance and reliability are required.
• High-density surface-mount PCBs — Chip-type construction and a compact φ10×10L package support power filtering on densely populated boards.
• Automated assembly environments — Supplied in embossed carrier taping and compatible with automatic mounting machines for high-volume production.

Unique Advantages

• Automotive-grade reliability: AEC-Q200 qualification and a 5000-hour endurance at 105°C support long-life deployments in vehicle electronics.
• Thermal robustness for reflow processes: Engineered for 260°C peak reflow, enabling compatibility with modern high-temperature assembly flows.
• Low impedance and controlled loss: 180 mΩ impedance and tan δ of 0.14 (at specified conditions) reduce AC losses and improve power-supply stability.
• High ripple handling: Defined ripple current ratings at both 120 Hz and 10 kHz help maintain filtering performance across low- and high-frequency domains.
• Compact SMD can package: φ10×10L size with embossed carrier taping minimizes board area while supporting automated placement.
• Regulatory compliance: RoHS compliance ensures suitability for regulated markets and environmentally conscious designs.

Why Choose UWD1H151MCL1GS?

The UWD1H151MCL1GS combines a compact SMD can package with measured low-impedance behavior, defined ripple-current capability, and long-term high-temperature endurance to address demanding power-filtering requirements. Its AEC-Q200 qualification and 260°C reflow compatibility position it for use in automotive and other high-reliability assemblies where automated production and thermal resilience are required.

Choose this part when your design needs a proven surface-mount aluminum electrolytic solution with clear electrical characterizations, reliable leakage and ripple specifications, and packaging suited for high-volume surface-mount manufacturing.

For pricing, lead time, or to request a quote for UWD1H151MCL1GS, please submit a quote request or contact sales with your project requirements and quantity.