UWD1H270MCL1GS

The UWD1H270MCL1GS is a surface-mount aluminum electrolytic capacitor in Nichicon’s UWD series designed for compact, high-temperature board assemblies. It is a chip-type SMD capacitor with a 27 µF capacitance and a 50 V rating, intended for use where a small, robust polarized capacitor is required.

Key value propositions include high-temperature endurance (rated to 105°C), AEC-Q200 qualification, and compatibility with high-temperature reflow processes, making it suitable for demanding electronic assemblies in automotive and industrial markets.

Key Features

• Capacitance & Voltage — 27 µF nominal capacitance with a 50 V rated voltage, specified tolerance of -20% to 20%.
• Low Impedance Performance — Rated impedance 680 mΩ and tanδ (DF) 0.12 measured at 20°C, 120 Hz, 50 V for stable AC performance.
• Ripple Handling — Low-frequency ripple current 92.5 mA (120 Hz) and high-frequency ripple current 185 mA (10 kHz), supporting ripple filtering in power circuits.
• Leakage Current — Specified leakage current of 13.5 µA, measured under standard conditions.
• High-Temperature Endurance — Rated for operation from -55°C to 105°C with a life/endurance specification of 2000 hours at 105°C.
• Chip-Type SMD Package — Compact package size φ6.3×7.7 mm (diameter × length) in a radial, can-style SMD case designed for automatic mounting with embossed carrier taping.
• Process Compatibility — Designed for compatibility with high-temperature reflow; recommended peak reflow condition includes 260°C peak for brief exposure as described in the UWD series datasheet.
• Compliance & Qualification — RoHS compliant and AEC-Q200 qualified as noted in the product specifications.

Typical Applications

• Automotive electronics — Suitable for automotive systems where an AEC-Q200 qualified surface-mount electrolytic capacitor is required and operation up to 105°C is expected.
• Compact power modules — Use in space-constrained power supply boards that need a 27 µF, 50 V SMD capacitor with measurable ripple-handling capability.
• High-temperature assemblies — Appropriate for boards assembled using high-temperature reflow processes thanks to specified 260°C peak reflow compatibility.

Unique Advantages

• AEC-Q200 qualification: Provides documented qualification for applications requiring industry-standard reliability criteria.
• High-temperature endurance: Rated to operate from -55°C to 105°C with 2000 hours endurance at 105°C, supporting long-term operation in hot environments.
• SMD chip form factor: Compact φ6.3×7.7 mm package and embossed carrier taping enable automated placement for high-density PCB designs.
• Reflow process compatibility: Designed for 260°C peak reflow, allowing use in modern assembly flows that require high-temperature soldering profiles.
• Measured performance data: Specified impedance, tanδ, ripple currents, and leakage current values provide clear, verifiable parameters for power design and margining.

Why Choose UWD1H270MCL1GS?

The UWD1H270MCL1GS delivers a compact, surface-mount aluminum electrolytic solution that combines a 27 µF / 50 V rating with AEC-Q200 qualification and high-temperature endurance. Its low impedance, defined ripple-current capability, and controlled leakage and tanδ measurements make it suitable for designers specifying deterministic capacitor performance in demanding assemblies.

Manufactured by Nichicon and available in mass production, this component is positioned for customers targeting robust, production-ready designs in automotive and other high-reliability markets where reflow compatibility and thermal endurance are required.

If you would like pricing or availability for UWD1H270MCL1GS, request a quote or contact our sales team with your quantity and delivery requirements.