UWD1H470MCL1GS

The UWD1H470MCL1GS is a chip‑type aluminum electrolytic capacitor engineered for surface‑mount use on high‑density PC boards. It offers low impedance performance in a compact radial can SMD package and is designed to withstand high‑temperature reflow processes.

Targeted at demanding electronic assemblies, this part is rated for operation from −55°C to +105°C, carries AEC‑Q200 qualification, and is compliant with RoHS directives, making it suitable for automotive and other reliability‑focused applications where automated assembly is required.

Key Features

• Capacitance & Voltage — 47 µF nominal capacitance with a 50 V rated voltage and a capacitance tolerance of ±20% (at 120 Hz, 20°C).
• Low Impedance Performance — Designed as a low‑impedance chip type; specified impedance is 680 mΩ.
• High‑Temperature Operation — Specified operating temperature range from −55°C to +105°C with a rated lifetime of 2000 hours at 105°C.
• 260°C Reflow Compatible — Corresponds with 260°C peak reflow soldering; recommended reflow condition: 260°C peak for 5 s (with 230°C over 60 s, 2 passes as noted for certain sizes).
• Surface‑Mount, Automated Assembly Ready — Chip type designed for surface mounting on high‑density PCBs and applicable to automatic mounting machines fed with carrier tape.
• Ripple Current Ratings — Specified ripple current of 92.5 mA at 120 Hz and 185 mA at 10 kHz for frequency‑dependent AC performance considerations.
• Polarized Aluminum Electrolytic — Polarized capacitor suitable where polarized bulk capacitance is required in the design.
• Compliance & Qualification — Compliant with RoHS (2011/65/EU, (EU)2015/863) and AEC‑Q200 qualified for reliability‑sensitive programs.
• Compact Package — Radial can SMD package with module dimensions L: 7.7 × D: 6.3 mm and recommended land pattern L: 6.6 × W: 6.6 mm.

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and −55°C to +105°C operating range support use in automotive electronic modules requiring polarized bulk capacitance.
• High‑Density Surface‑Mount Assemblies — Chip‑type form factor and compact footprint are intended for space‑constrained PCBs where surface‑mount placement is required.
• Automated PCB Assembly — Compatible with automatic mounting machines fed by carrier tape, simplifying integration into automated production lines.
• High‑Temperature Operating Environments — Rated for extended operation at elevated temperatures with a 2000‑hour life at 105°C for thermal endurance in demanding designs.

Unique Advantages

• Low Impedance for Stable Power Delivery — The specified 680 mΩ impedance helps reduce voltage ripple and supports stable operation in power circuits.
• High‑Temperature Reflow Compatibility — Rated for 260°C peak reflow, enabling use with modern lead‑free assembly processes without compromising component performance.
• AEC‑Q200 Qualified — Qualification provides documented reliability for applications that require industry‑recognized component robustness.
• Automated Assembly Support — Designed for carrier‑tape feeding and surface mounting, lowering assembly complexity and improving throughput.
• Compact SMD Can Footprint — Small package dimensions and defined land pattern facilitate dense PCB layouts and straightforward footprint implementation.
• Regulatory Compliance — RoHS conformity helps designs meet regulatory requirements for restricted substances.

Why Choose UWD1H470MCL1GS?

The UWD1H470MCL1GS balances compact size, low impedance performance, and thermal endurance for designs that require reliable polarized bulk capacitance on surface‑mount high‑density PCBs. Its compatibility with 260°C peak reflow and automated tape‑feed mounting makes it practical for modern manufacturing processes.

This part is well suited to engineers and procurement teams specifying components for AEC‑Q200 qualified programs or other applications where RoHS compliance and extended operation up to +105°C with defined lifetime are important considerations.

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